Semiconductor Aluminum Oxide Deep Micro-Drilling

📈 Quality - remained consistent | ⚙️ Tool Life - Tool A achieved its applicability (from unable to machine to drilling 4 holes/per tool) ; Tool B improved 440%


What makes Al2O3 (Aluminum Oxide) difficult to machine?


Al2O3 (Aluminum Oxide), also known as Alumina, is the most popular ceramic material.  The major difficulties in machining Al2O3 lie in its material properties.  Al2O3 is known for its high hardness and brittleness.  It possesses superior wear and corrosion resistance and has excellent thermal conductivity.  This material's excellent chemical resistance and thermal stability have made it ideal for semiconductor processing applications. 

However, it is a very difficult to machine material that it might result in relatively poor surface quality and subsurface damage during the machining process.  Its stiffness may also cause severe tool wear and greatly affect the stability in tool life.


☑️ Al2O3 (Aluminum Oxide) Machining Information
 
  Al2O3 (Aluminum Oxide) Machining Information
  Material   99.5%  Al2O3 (Aluminum Oxide)
  Dimensions   Tool A spec. Φ0.3 x 4.5mm (to drill Φ0.3 x 4.4mm blind holes)
  [aspect ratio : 14.7]
  Tool B spec. Φ0.3 x 5.5mm (to drill Φ0.3 x 5.4mm blind holes)
  [aspect ratio : 18]
  Methods   Deep micro-drilling
  Machine Tool   Buffalo MCU-5X
  Max. Spindle Speed   15,000 rpm (18,000/24,000 rpm)
  Tool Rotating Speed   12,000 rpm
  Spindle Taper   BT40 / CAT40 / HSKA63
  Tool Holder   HSKA63-06
  Integrated System   CTS; ATC; CNC Automation


 

Zirconia oxide micro drilling-Hantop Intelligence Tech.
(Figure. ultrasonic machining on Al2O3 workpiece)

 

HIT's Goal in Machining Al2O3


To examine the ultrasonic effects on the tool life of two different types of drilling tools when conducting Al2O3 (Aluminum Oxide) deep micro-drilling.



Ultrasonic-Assisted Machining Al2O3 Results


[Tool A spec. Φ0.3 x 4.5mm]
The cycle time for Tool A to drill a Φ0.3 x 4.4mm blind hole was around 120 seconds.
Without ultrasonic-assisted machining technology, Tool A was unable to machine with this dimension.
With HIT's ultrasonic-assisted machining technology, Tool A managed to drill 4 holes/per tool.

[Tool B spec. Φ0.3 x 5.5mm]
The cycle time for Tool B to drill a Φ0.3 x 5.4mm blind hole was around 150 seconds.
Without ultrasonic-assisted machining technology, Tool B could only drill 5 holes/per tool.
With HIT's ultrasonic-assistedf machining technology, Tool B managed to drill 27 holes/per tool.


 

HIT Ultrasonic Machining Technology Achievements


📈 Quality - remained consistent
⚙️ Tool Life - Tool A achieved its applicability (from unable to machine to drilling 4 holes/per tool)
                                  Tool B improved
440%
 
  HIT ultrasonic Non-ultrasonic
  Tool A’s tool life
  (spec. Φ0.3 x 4.5mm)
4 holes/per tool Unable to machine
  Tool B’s tool life
  (spec. Φ0.3 x 5.5mm)
27 holes/per tool 5 holes/per tool


 

Deep micro-drilling Al2O3 (Aluminum Oxide) has been widely applied in the Semiconductor industry,
especially for electrical insulators, ceramic substrates, etc.



💡 Al2O3 electrical insulators : 

Fish spine beads are used as a practical way of insulating wires with the beads interlocking together to provide electrical insulation in continuity.  The beads manufactured from Al2O3 inherit strong mechanical and electrical properties from this material.
However, the product quality and tool life are both extremely difficult to control due to the high hardness and brittleness of this material.  Especially for such challenging feature and dimensions, it is very difficult and even a mission-impossible for traditional machining process.
This is where HIT's Ultrasonic Machining Module comes in handy!  We offer a comprehensive solution in machining these difficult-to-cut materials.  With the assistance of our Ultrasonic Machining Technology, clients need not worry about unstable tool life when machining this kind of material.  We can assure our clients of fulfilling their needs and even achieving better outcome!


💡 Al2O3 ceramic substrates : 

Substrates mainly play the role of mechanical support protection and electrical insulation in the process of electronic packaging.  Al2O3 ceramic is the most mature and widely used ceramic packaging substrate material, due to its several advantages such as high strength, good insulation, good thermal conductivity and heat resistance.
However, the product quality and tool life are very hard to control due to the high hardness and brittleness of this material.
This is where HIT's Ultrasonic Machining Module comes in handy!  We offer a comprehensive solution in machining these difficult-to-cut materials.  With the assistance of our Ultrasonic Machining Technology, clients need not worry about unstable tool life when machining this kind of material.  We can assure our clients of fulfilling their needs and even achieving better outcome!