Semiconductor SiC micro-drilling Low Cycle Time per Hole High Precision Longer Tool Life HIT Achievements HIT Highlights & Comparison Industry Application Difficulties in Machining Back to list SiC micro-drilling - HIT Achievements Machining Results in macroscopic and microscopic view Average hole data and graph: Highlights of HIT Ultrasonic Module ： Low Cycle Time per Hole High Precision Longer Tool Life SiC micro-drilling - HIT Highlights & Comparison HIT Highlight and comparison Method Laser Special Drilling Machining CNC HIT Ultrasonic Machining Module +CNC Advantages in SiC machining Hi- efficiency Special purpose for drilling Low cost Can process to finished artifacts only using CNC Hi-precision and Hi-Efficiency compared to forwards. Easily remove cutting scraps Longer tool life by high frequency vibrations subtly remove materials and prevent crashing directly Low cost compared to Special drilling machine Bear the advantages of CNC machining and special drilling machine. HIT Ultrasonic can create a economic but high precision and efficiency solution Disadvantages Restrictions of materials thickness Prone to have scorched or raised surface on the edge of work pieces. High equipment cost Not flexible to other machining feature The rotation speed is limited to the volume of the drilling machine The lack of quality Short tool life The problem of removing cutting scraps Relatively better solutions compared the front three solutions SiC micro-drilling - Industry Application Belong to one type of advanced ceramics, SiC bears excellent mechanic properties such as high melting point, high hardness, great chemical stability and abrasion resistance. For those advantages, SiC has been utilized in a wide array of modern industries components under extreme conditions. The application of SiC mainly focuses on four aspects like refractory materials, wear-resistant high-temperature parts, abrasive molds and bulletproof armor. Recently, since the era of 5G is coming, SiC has been discovered new functions in cellphone components. To deal with the growing function of mobile phones, we need to arrange chips and modules inside the mobile phone denser than before. Which causes severe electromagnetic susceptibility. SiC is considered to be well electromagnetic shielding materials because of its wave absorption characteristics. On the other hand, the denser the chips and modules arranged inside one mobile device, the greater heat it will be generates, thus, causing frequent malfunction when operating. SiC is an excellent flame-proof materials and equips high melting points, it can also play as thermally conductive material to prevent malfunction due to temperature increase as well as heat accumulation. In this case, we’ll validate SiC micro-drilling with HIT Ultrasonic Machining Module combined normal CNC machine. Without special purpose machine, our module can assist maintaining the drilling stability and at the same time enhancing the tool life effectively. SiC micro-drilling - Difficulties in Machining As forward, we know that SiC has excellent properties like hard and abrasion resistance, but it also has brittle properties that cannot endure excessive power of knocking. By conventional CNC method, the crashing between tools and SiC materials often creates micro-crack on the edge, causing shatter, uneven cutting surface. And for drilling, the cutting removal is another essential part. The scrap during machining is easily to accumulate inside the drilling hole. Hence, the hard SiC scrap will rub and harm the machined surface. and the accumulation also damage the tools and shortening the tool life.