2020/11/17
HIT will hold an Ultrasonic Application Seminar in 2020/12/10! Welcome manufacturers from various industries to join us.
Register URL: https://reurl.cc/Xkgpe7
The topic will focus on ultrasonic machining technique applied on tungsten carbide, Inconel, advanced ceramic, and semiconductor materials. With the practical validation from clients, It will be more easy to take your own situations into our examples and learn deeply about ultrasonic machining technology!
If there are more than three people in the same company sign up for HIT Seminar, we will serve you a product discount and latest information of ultrasonic technology!
Time: 2020/12/10 (Thurs)
Place:
Room 202, No. 19, Keyuan Road, Xitun District, Taichung City
(We will change the place depends on the number of attendees, the latest information will send to the attendee’s mail and upload to the website.)
13:00-13:30 Registration
13:30-13:40 Opening
13:40-13:50 Introduction to the principle of ultrasonic vibration-assisted processing-Tony Wang
13:50-14:10 Tungsten Carbide and processing experience sharing-Glen Chang
14:10-14:30 Inconel processing and experience sharing- W.K. Chen
15:00-15:20 Advanced ceramics: alumina and zirconia-
Harrison Hong
15:20-15:40 Semiconductor material processing experience sharing-Alvin Hoo
15:40-15:50 HIT Product Introduction-Tony Wang