Group photo of Professor Michael Chen, the founder of HIT, and Dirac Liao, CEO of HIT.
HIT was honored to be interviewed by DIGTIMES. Ultrasonic Machining keeps competitive in semiconductor and aerospace industries.
Report from: https://reurl.cc/V6yE6n
Due to the problem of minority, old age and global sustainability, people start to pursue better material life for the changing era. From 5G mobile for
Faster information transmission, demands of safer but lightweight transportation, and Biologically inert medical equipment needs, the huge
demands of new materials from various industries boosts CNC machining to a new level.
Since founded in 2018, HIT has committed to listen to market needs. The founder of HIT, Professor Michael Chen, has dedicated himself for academia and industrial cooperation for a long time. Discovering that manufacturers have been troubled with low-efficiency and short tool life while machining new materials, he combined his experience and expertise to develop HIT ultrasonic machining module.
Ultrasonic application is common to see in everywhere, but the highlight of HIT Ultrasonic machining Module is that it can both enhance machining performance and allows manufacturers technology upgrading with their original equipment. Ultrasonic machining technology has long monopolized by Japan and Germany, such as DMG and DISCO. Introducing a new equipment will be time-costing and expensive. HIT module adopts plug and play design can simply be retrofitted to any CNC machine. Moreover, the automatic tracking system allows manufacturers to introduce and produce in just one day.
