Semiconductor SiC micro-drilling

Low Cycle Time per Hole High Precision Longer Tool Life
Machining Results in macroscopic and microscopic view
SiC micro drilling machining results- Hantop Intelligence Tech.

Average hole data and graph:
SiC micro drilling graph

SiC micro drilling data- Hantop Intelligence Tech.


Highlights of HIT Ultrasonic Module :
  • Low Cycle Time per Hole
  • High Precision
  • Longer Tool Life
HIT Highlight and comparison
Method
Laser 
Special
Drilling
Machining
CNC
HIT Ultrasonic Machining Module +CNC
Advantages in SiC machining
Hi- efficiency
Special purpose for drilling 
Low cost
Can  process to finished artifacts only using CNC
 
Hi-precision and Hi-Efficiency compared to  forwards.
 
Easily remove cutting scraps
 
Longer tool life by high frequency vibrations subtly remove materials and prevent crashing directly 

Low cost compared to Special drilling machine 
 
Bear the advantages of CNC machining and special drilling machine. HIT Ultrasonic can create a economic but high precision and efficiency solution 
 
Disadvantages
Restrictions of materials thickness
Prone to have scorched or raised surface on the edge of work pieces.
High equipment cost
Not flexible to other machining feature
The rotation speed is limited to the volume of the drilling machine
The lack of quality
Short tool life
The problem of removing cutting scraps
Relatively better solutions compared the front three solutions
 

 

Belong to one type of advanced ceramics, SiC bears excellent mechanic properties such as high melting point, high hardness, great chemical stability and abrasion resistance. For those advantages, SiC has been utilized in a wide array of modern industries components under extreme conditions. The  application of SiC mainly focuses on four aspects like refractory materials, wear-resistant high-temperature parts, abrasive molds and bulletproof armor.

Recently, since the era of 5G is coming, SiC has been discovered new functions in cellphone components. To deal with the growing function of mobile phones, we need to arrange chips and modules inside the mobile phone denser than before. Which causes severe electromagnetic susceptibility. SiC is considered to be well electromagnetic shielding materials because of its wave absorption characteristics. On the other hand, the denser the chips and modules arranged inside one mobile device, the greater heat it will be generates, thus, causing frequent malfunction when operating. SiC is an excellent flame-proof materials and equips high melting points, it can also play as thermally conductive material to prevent malfunction due to temperature increase as well as heat accumulation.

In this case, we’ll validate SiC micro-drilling with  HIT Ultrasonic Machining Module combined normal CNC machine. Without special purpose machine, our module can assist maintaining the drilling stability  and at the same time enhancing the tool life effectively.

As forward, we know that SiC has excellent properties like hard and abrasion resistance, but it also has brittle properties that cannot endure excessive power of knocking. By conventional CNC method, the crashing between tools and SiC materials often creates micro-crack on the edge, causing shatter, uneven cutting surface.

And for drilling, the cutting removal is another essential part. The scrap during machining is easily to accumulate inside the drilling hole. Hence, the hard SiC scrap will rub and harm the machined surface. and the accumulation also damage the tools and shortening the tool life.