Semiconductor Alumina Oxide Crucible machining

For precise alumina oxide machining , CNC grinding and laser might be the two most common way.  With improper cutting force, grinding may cause hard and brittle ceramics materials more easily generate micro-crake in its structures, These micro-cracks will spread through all of the materials through machining process, resulting in crystalline grain exfoliation. Furthermore, for higher demands in surface quality, many manufacturers will choose polishing procedure. Alumina oxide ceramics is difficult to remove its materials, deciding low efficiency in polishing procedure.

The other solution is laser machining to process sophisticated features. Though small range of laser cutting can carve more precisely, it is limited by the thickness of materials and easily scorched the surface.





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Highlights of HIT Ultrasonic Machining Module:

  • 5 Times Machining Efficiency  
  • Longer Tool Life
  • Less Process , but Same Quality and Even Better
 


Crucible are kinds of container that allows materials burning in a incredibly high temperature (about 1500 Celsius degrees). It is often made in different shapes like cylindrical and bowl-shape in shallower or deeper bottom.

Many types of materials can be the choices for crucible, and ceramics are relatively inexpensive one. Also, ceramics are excellent refractory and bear stable chemical properties, which isn’t easy to react with others. Aluminum oxide is one kind of high hardness ceramic, and widely used in energy, defense, and aerospace industries. Aside from hardness, the properties heat resistance, insulation and wear resistance make it a suitable materials in crucibles.

Despite Alumina Oxide bears excellent mechanical properties,  the challenges in its hardness and brittleness have existed till nowadays. Crucible also require special demands in smooth surface and various shaping.

In this case, we manufacture alumina oxide crucible  with traditional CNC machine side-add on our HSKA63 ultrasonic machining module. Effectively  decreased  the processing time to 83% and gain better quality.