MECT 2025 | Dynamic Tools Corp. ダイナミックツール株式会社 x HIT Ultrasonic 2025/09/30 MECT 2025 | Dynamic Tools Corp. ダイナミックツール株式会社 x HIT Ultrasonic The biggest Japanese Machine Tool Show in 2025 — the MECT 2025 — will be held from October 22 to 25 at Port Messe, Nagoya! 📅 Date: Oct. 22nd (Wed.) ~ 25th (Sat.), 2025 🕑 Time: 10:00 AM - 5:00 PM (Last day till 4:00 PM) 👣 Location: Port Messe Nagoya, Exhibiton Hall 3 🎪 Booth: 3E16 🤝 In cooperation with Dynamic Tools Corporation ダイナミックツール株式会社 🔗 Visitor Pre-Registration MECT is Japan's largest domestic equipment and technology show, held biennially in the autumn. This year marks the 20th edition, bringing together machinery manufacturers, component suppliers, and equipment providers from Japan and abroad. Visitors will discover cutting-edge, innovative manufacturing technologies and products. At the previous exhibition, MECT 2023, Hantop Intelligence Tech. (HIT) collaborated with its Japanese distributor Dynamic Tools Co., Ltd. (ダイナミックツール株式会社) to showcase ultrasonic-assisted machining technology, including applications for new semiconductor materials such as silicon carbide (SiC) and quartz glass. This year, HIT will once again join forces with Dynamic Tools to present the latest UD7 ultrasonic drive module and ultrasonic grinding toolholder series. In addition, the booth will highlight ultrasonic machining applications for advanced semiconductor packaging materials such as Aluminum Silicon Carbide (AlSiC), demonstrating their effectiveness in rough grinding. 🎬 WATCH NOW to learn how the new material Aluminum Silicon Carbide (AlSiC) will be applied in high-end semiconductor packaging in the future! Interested in exploring more about ultrasonic machining for next-generation semiconductor materials⁉️ Visit us at MECT 2025 in Nagoya, Port Messe, Hall 3, Booth 3E16, and discover the possibilities of ultrasonic.💝 - Hantop Intelligence Tech. ✨Ultrasonic Process Solution for Advanced Materials✨ ☎️ +886-4-2285-0838 📧 sales@hit-tw.com ←Back