With the rapid advancement of AI technology and the explosive demand for computing power, high-performance AI chips are facing unprecedented "thermal challenges." Traditional heat dissipation solutions have gradually become a technical bottleneck in advanced packaging. To unlock new business opportunities, Hantop partnered with industry leaders to host the "AlSiC Technology Exchange Seminar" at CHAMPMILL's Northern Regional Office on June 12, 2026.
This event focused on cross-industry communication and collaboration, deeply integrating "materials, cutting tools, equipment, and technical applications," with the expectation of injecting new momentum into Taiwan's precision machining supply chain as it enters the semiconductor application sector.
During this seminar, Hantop integrated CHAMPMILL's 5-axis machining center, Taiwan Asahi Diamond's PCD tools, CMTEK's advanced AlSiC materials, and Hantop's ultrasonic machining module, delivering a comprehensive, one-stop technological perspective for the processing and manufacturing of semiconductor AI chip packaging materials.
Market Insight: The Heat Dissipation Solution for the AI Generation—AlSiC
Amid global market trends, the demand for traditional metal processing is gradually saturating, while the application of hard and brittle materials, such as ceramics, is growing rapidly in the semiconductor field. Mr. Shih-Huang Chu, Senior Director of Hantop Intelligence Tech, and Mr. Liu Ming-Chieh, Deputy Manager of CHAMPMILL, provided an in-depth analysis of market trends and machining case studies during the event.
Mr. Tseng, Manager of CMTEK, pointed out that Aluminum Silicon Carbide (AlSiC), featuring "high thermal conductivity and low thermal expansion," is exactly the heat dissipation savior for the AI-generation semiconductors. However, as a composite material combining "high-hardness ceramics" and "tough metals," AlSiC presents a tremendous challenge for conventional machining processes.
Hantop's Ultrasonic Technology ft. CHAMPMILL: Unlocking the Precision Machining Challenges of AI Chip Heat Spreaders
Targeting the precision machining of AlSiC heat spreaders for AI chip applications, Hantop released its latest technical video, perfectly demonstrating how to shatter machining bottlenecks by utilizing a "CNC Machine Tool combined with an Ultrasonic Machining Module."
The hardware configuration showcased at the technology exchange seminar included:
🎬 Live Demonstration: Four Major Precision Grinding Processes for AlSiC Heat Spreaders
In the live demonstration, the technical team utilized a #100 6.4mm diamond grinding pin. Operating at 9,000 rpm with the ultrasonic power set to 100%, the team demonstrated four primary processes:
| 工序名稱 |
進給速率 (F) |
軸向切深 (Ap) |
徑向切深 (Ae) |
工藝特點 |
| 工序 1 / 底磨 |
800 mm/min |
0.05 mm |
1.28 mm |
高速平穩去除表面材料 |
| 工序 2 / 開槽 |
150 mm/min |
0.05 mm |
6.4 mm |
超音波高頻微振，降低磨削阻力 |
| 工序 3 / 斜度磨 |
500 mm/min |
0.05 mm |
2 mm |
A-30度傾斜精密磨削 |
| 工序 4 / 直角磨 |
300 mm/min |
0.05 mm |
1 mm |
A-90度精準清角磨削 |
💡 The Revolutionary Benefits of Integrating Hantop's Ultrasonic Machining Module:
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From Unmachinable to Smooth Processing: Under identical machining parameters, machining without ultrasonics resulted in abnormal sounds and incomplete processing; after introducing Hantop's ultrasonic technology, the process became highly stable and smooth.
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Enhanced Workpiece Surface Quality: Without ultrasonics, the forced machining sections exhibited a high surface roughness of Ra 1.3µm with obvious tool marks. With the integration of Hantop's ultrasonic technology, the surface roughness was significantly optimized to Ra 0.21µm, perfectly eliminating surface tool marks and ensuring the ultimate fit for the heat spreader.
-
Excellent Chip Removal and Extended Tool Life: The high-frequency micro-vibration of ultrasonics substantially optimizes chip removal, shortens roughing time, and significantly extends tool life.
Cross-Boundary Alliances: Building a High-End Smart Manufacturing Ecosystem
In this joint seminar, the host, Hantop, and four leading partner companies connected closely to jointly demonstrate how to integrate the hardware and software ecosystem to achieve micron-level high-precision machining:
1. CHAMPMILL
Showcased the C40-5A/5U series 5-axis machining centers tailored for highly complex geometric parts. Utilizing A/C axis roller cam transmission and extreme temperature control, it achieves zero-backlash, high-precision machining, providing a highly rigid machine base that balances maximum speed and stability for high-end materials.
2. Taiwan Asahi Diamond
Brought an efficient processing tool for superhard materials—the PCD Multi Edges tool. Its cutting edge is entirely made of PCD (Polycrystalline Diamond), designed specifically for super hard and brittle materials like CVD-SiC focus rings, offering both high precision and extended lifespan, thereby significantly reducing machining time.
3. CMTEK
Provided an in-depth analysis of the structural advantages and future adoption trends of Ceramics Matrix Composites (CMC), laying a solid theoretical and practical foundation for advanced packaging materials with high thermal conductivity and low expansion coefficients.
4. TOCHANCE
Shared the practical applications of ultrasonic modules in equipment integration and automated production lines, discussing how to assist traditional processing plants in overcoming transitional challenges, linking production data chains, and optimizing overall manufacturing efficiency.
Live Machine Demonstration and Technical Exchange: Co-creating Excellence!
In addition to the excellent technical presentations, CHAMPMILL also arranged live machine and machining technology demonstrations, allowing attendees to personally experience the stunning performance of the machine tool combined with advanced cutting tools and Hantop's ultrasonic technology. The rich Q&A sessions and tea break networking further sparked numerous cross-boundary collaboration opportunities in the field of advanced semiconductor packaging!
🎬 [Video Highlight] Stunning Machining Video
Welcome to watch the official video released by Hantop: "[Ultrasonic Machining] Precision Grinding for AI Chip Applications - AlSiC Heat Spreader ft. CHAMPMILL (5-Axis Machining Center)" (Video Link:https://www.youtube.com/watch?v=iXOF9ADG3No) Witness through this dynamic video how Hantop's ultrasonic module leads the industry in overcoming the tough challenges of advanced packaging material processing!