Huawei P40 Pro+ launched 3/26, responding the trend of 5G ceramic back plate 2023/02/20 Huawei P40 Pro+ launched 3/26, responding the trend of 5G ceramic back plate Huawei 3/26 announced the new flagship model P40 series in 2020. There are three models including P40, P40 Pro and the highest-end P40 Pro +. The highest-end P40 Pro + is similar in appearance to the P40 Pro, but uses a ceramic material back plate for moister feel and a durable back. The screen has four curved surfaces and can be seen that there are micro-arc surfaces around the screen. Full screen and a more compact body show the improvements in mobile phone ceramic back plate machining technology It is becoming more and more difficult for mobile phones to create a differentiated market. Pursuing differentiation from body materials has also become the direction of brand research and development. Changes in metal, glass, ceramic, and mobile phone case materials Since the release of Xiaomi 5, the ceramic materials used in its body have become the research direction of various manufacturers. The material chosen does determine the performance of the product, but the process from material to finished product also plays a crucial role in product quality. The advantages of ceramic materials are high hardness and scratch resistance. The touch is different from cold metal or plastic. Ceramic materials are very moist and skin-friendly. At the same time, it has a high refractive index and high dispersion, low thermal conductivity and insulation properties, high dielectric constant, does not mask signals, does not affect antenna layout, and has good mechanical properties, high bending strength, wear resistance, High structural strength. (Ceramic Mohs hardness is 9.0, close to sapphire), it is a great choice for the back cover of high-end flagship models of mobile phones in the 5G era. However, the ceramic materials requires to control the best time and temperature to achieve the best hardness during sintering. The volume shrink irregularly after sintering also becomes a challenge to machining technology due to the high demand in mobile parts. Due to the hard and brittle nature of the ceramic material, improper cutting force during machining may cause micro-cracking of the structure, causing grain collapsing. Subsequent polishing is also inefficient due to the low material removal rate of ceramics. The difficulty to process resulted in cost problem, making it could be used for some high-end flagship models. The introduction of ultrasonic machining technology has made hard and brittle materials a big step forward. Slight vibration at high frequency can effectively reduce cutting resistance, avoiing micro-cracks of ceramic structure caused by excessive impact, and can achieve better surface quality and accuracy. Ultrasonic Machining provides effective solution to ceramic back plate processing The Ultrasonic Machining Module of Hantop Intelligence Tech. adopts non-contact power transmission technology, which do not limit the original high rotating speed and can up to 38000 rpm. The other unique design is automatically tracking system. It can be adapted to different ceramic materials to achieve the optimal amplitude, so that the processing process does not cause no effect or structural fragmentation due to too small or too large amplitude. Through those optimization designed by HIT, the advantages of ultrasonic machining can be maximized in terms of improving the quality of the processed surface and saving the use of materials. In addition, according to the requirements of the work piece, our module can be processed at a higher feed rate, which improves the processing efficiency by more than 30%. If you are interested in the application of ultrasound, you can go to our technical introduction to learn more about the principles and uses of ultrasound processing. It is also recommended to watch our website regularly to get the latest ultrasonic processing verification results! Contact us for complete ultrasonic machining solution. What’s the specialties of HIT Ultrasonic Machining Module? How can HIT Ultrasonic machining technology work in new materials machining? Application cases validated with HIT Ultrasonic Machining Module ←Back