Group photo of  “The smart technology exchange and application seminar”

Special Lecture by scholars of National CHung Hsin University


The attendees visit HIT Booth.

 

The smart technology exchange and application seminar hosted by The Shackleton Project, the Chinese Institute of Engineers, Office of Research and Deveolopment, and General Center for Academia-Industry Collaboration of National Chung Hsing University and had come to a successful conclusion on 8/18.

Sincerely appreciate all the participants of the Chinese Institute of Engineers for attending HIT speech by our founder- Professor Michael Chen as well as our booth to experience ultrasonic machining technology.

 

Now that pandemic seriously affects the global supply chain. Beyond tense Sino-US relations, many manufacturers have to reorganize their steps to respond to the global semiconductor demand that has grown rapidly year by year. The introduction of new technology has gradually become a key. HIT has aimed on semiconductor new materials machining and developed ultrasonic machining module technique.   Welcome to keep track on relevant news of HIT and join us in exhibition for the latest trend in industry and performance of ultrasonic machining.

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Application cases validated with HIT Ultrasonic Machining Module