News Report from Commercial Times

Despite the postponement and cancellation of the exhibition due to the outbreak of COVID-19, the market trends of new materials machining have still gone viral. Estimated by
WSTS (World Semiconductor Trade Statistics), the total output value of semiconductor industries is anticipated to grow about 8.4%; The demands of long-distance communication have boosted the growth of Notebook production, and 3 main notebook manufacturers—Intel, Compal, and Quanta has been optimistic about the prospect.

As the growth in semiconductor industries, electrical automobile, 5G communication, and 3C electronics has soared, the machining problems have emerged. For example, CVD-SiC, which commonly applied in the etching process, is difficult in fine surface machining and micro-feature machining; CFRP that applied in the outer case of 3C electronics or automobile is prone to have wrinkles, burr, and delamination.

Ultrasonic machining technology reduces cutting resistance and enhances tool life via each micro-oscillation. Each vibration removes materials slightly and precisely and reduces the edge-cracks and subsurface damage in brittle materials machining. Also, the micro-vibrations count for composites materials by reducing burr and delamination. HIT has developed module techniques with ultrasonic machining function. It enables customers to install on their current machine and product in just one day. Our module has been introduced into mass production lines of suppliers of TSMC or international semiconductor manufacturers.

More semiconductor applications