Semiconductor Quartz micro-drilling Difficulties in Machining HIT Achievements Industry Application Back to list Quartz micro-drilling - Difficulties in Machining Quartz micro-drilling - HIT Achievements Picture of Artifact: Features Quartz micro-drilling Hole Diameter 0.5mm/Depth 5mm (Blind) Difficulties Difficult in continuously high aspect-ration-drilling(10X) Severe edge-cracks caused by extreme hardness Low efficiency for high precision Comparison of cycle time Under the condition of rotary speed <10000 rpm and the quality standard (inlet chipping < 0.1mm, the outlet chipping < 0.2mm), our goal in this validation is to shorten the cycle time to three minutes per hole. With HIT Ultrasonic machining technology, we have achieved the performance of 1 minute and 44.1 seconds per hole, enhancing 4 times of efficiency under only 8000 rpm operating speed. Highlights of HIT Ultrasonic Machining Module •Efficiency up to 400% •Tolerance<0.05mm •Edge-Crack<0.04mm Quartz micro-drilling - Industry Application 💡 Learn more about Quartz Machining cases Quartz Machining : Micro-Drilling (Optoelectronics Industry Application) Quartz Machining : Micro-Drilling (Semiconductor Industry Application) 💡 Introduction on Quartz Machining Quartz Machining in Semicon- and Optical Industries