Semiconductor CVD-SIC Grinding

⚙️ Tool Life - material backfill condition reduced by 50% ; tool wear reduced over 50%
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes CVD-SiC (Chemical Vapour Deposition-Silicon Carbide) difficult to machine?

The major difficulties in machining CVD-SiC lie in its material properties.  CVD-SiC is known for its outstanding resistance to wear, corrosion, and thermal shock.  This material's stiffness, durability, and stability have made it ideal for semiconductor processing applications. 

However, it is also a relatively brittle material that severe fracture, tool wear, and material backfill can result when trying to machine it by using traditional methods.

☑️ CVD-SiC Machining Information
  CVD-SiC Machining Information
  Material   CVD-SiC
  Dimensions   Ap : 0.005mm
  Methods   Grinding
  Machine Tool   YCM NFP-55LX
  Max. Spindle Speed   43,000 rpm
  Tool Rotating Speed   5,000 rpm
  Spindle Taper   HSKE40
  Tool Holder   HSKE40-10
  Integrated System   ATC; CNC Automation


(Figure 1. the comparison of non-ultrasonic and ultrasonic effects on the CVD-SiC workpiece)

(Figure 2. the comparison of material backfill situation between non-ultrasonic and ultrasonic-assisted machining)

Client's Goal in Machining CVD-SiC

To compare the ultrasonic-assisted machining technology on the tool wear when conducting CVD-SiC grinding with non-ultrasonic technology.

Ultrasonic-Assisted Machining CVD-SiC Results

With HIT's ultrasonic-assisted machining technology, the total amount of tool wear after grinding 4 holes were close to the total amount of tool wear after grinding only 1 hole without ultrasonic technology.

HIT managed to reduce material backfill of the machining tools by 50%, while matching up with client's requirements on the quality.

HIT Ultrasonic Machining Technology Achievements

⚙️ Tool Life improved - Material backfill condition reduced by 50%
                                                  - Tool wear reduced over 50%


CVD-SiC part machining has been widely applied in the Semiconductor industry, especially for wafer support and semiconducting components.

💡  CVD-SiC semiconductor components : 

Components made of CVD-SiC offer outstanding chemical resistance, thermal conductivity, stiffness and thermal shock resistance.  These advantages have made it suitable for semiconducting components, such as susceptors, lift pins, electrodes, chamber liners, etc.
However, the product quality and tool life are hard to control due to the properties of this material.  This potentially results in huge expense in time and money during its machining process.
This is where HIT's Ultrasonic Machining Module comes in handy!  We offer a comprehensive solution in machining these difficult-to-cut materials. 
 With the assistance of our Ultrasonic Machining Technology, cutting force is greatly reduced and the coolant can function effectively due to high-speed frequency oscillation.  This prevents excessive amount of entangled chips which can result in severe damage to the surface and the tools.  We can assure our clients of fulfilling their needs and even achieving better outcome!