Semiconductor [CSC02] SiC Connecting Part Machining

🕜 Efficiency increased 75% | 📈 Quality improved - smooth surface without tool marks | ⚙️ Tool Life increased 300%
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes SiC (Silicon Carbide) difficult to machine?


The major difficulties in machining SiC lie in its material properties.  Belonging to one type of advanced ceramics, SiC bears excellent mechanical characteristics, such as high melting point, high hardness, great chemical stability and abrasion resistance

Despite having these advantages has made this material useful within several industries, it is nevertheless relatively brittle.  It could cause severe tool wear and sub-surface damage when receiving excessive cutting force, and this could also be a time-consuming machining process.


☑️ SiC Connecting Part Machining Information
 
  SiC Connecting Part Machining Information
  Material   SiC
  Dimensions
  [Shoulder] 1st : Φ51 x 6mm
  [Shoulder] 2nd (upper) : Φ30 x 5mm
  Central Hole : Φ20 x 11mm
  Chamfer : R0.5*5
  Methods   Shoulder milling; Slot milling; Chamfer milling
  Machine Tool   -
  Max. Spindle Speed   -
  Tool Rotating Speed   17,000 rpm
  Spindle Taper   BT30
  Tool Holder
  BBT30-GEN-06
  Integrated System   CTS; ATC; CNC Automation

 
SiC parts machining results comparison - Hantop Intelligence Tech.
(Figure. the comparison of SiC connecting part before and after ultrasonic machining)



HIT's Goal in Machining SiC


Our goal is to examine the ultrasonic effects on SiC connecting part, as well as to identify the different outcomes after adjusting the machining parameters for ultrasonic machining process.
 


Ultrasonic-Assisted Machining SiC Results


Without ultrasonic-assisted machining, it might even be impossible to complete the SiC connecting part.

Before adjusting the machining parameters when the ultrasonic was on, the SiC connecting part could be completed, but the process took 4 hours and one tool could only finish one workpiece.

After adjusting the machining parameters when the ultrasonic was on, the process took 3 hours and one tool could finish three workpieces.

 


HIT Ultrasonic Machining Technology Achievements


🕜 Efficiency increased 75%
📈 Quality improved - smooth surface without tool marks
⚙️ Tool Life increased 300%
💰 Cost saved - machining tool costs around US$200~300/per tool
 
  After adjusting parameters Before adjusting parameters
  Quality Smooth surface without tool marks -
  Efficiency 180 min/per workpiece 240 min/per workpiece
  Tool Life 3 pieces/per tool ≤ 1 piece/per tool

 

SiC connecting part machining has been widely applied in many industries, such as Semiconductor industry and 3C Electronics industry.


This material can be used for various products, including bulletproof vests, ceramic plates, MOSFETs, and power electronics, etc.


💡  SiC 5G power devices : 

SiC has many outstanding properties, such as high switching frequency, high operating temperature, high power density, great thermal management, etc.  These advantages allow power devices made of this material to make power electronic modules more powerful and energy-efficient than those made with conventional materials.
Machining this kind of material, however, requires huge expense in time and money due to its machining characteristics.
This is where HIT's Ultrasonic Machining Module comes in handy!  We offer a comprehensive solution in machining these difficult-to-cut materials. 
 With the assistance of our Ultrasonic Machining Technology, cutting force is greatly reduced and the coolant can function effectively due to high-speed frequency oscillation.  Clients need not worry about surface damage or edge-cracks in this kind of feature.  We can assure our clients of matching up with their requirements or even achieving better outcome!