Semiconductor SiC connecting parts machining

Belong to one type of advanced ceramics, SiC bears excellent mechanic properties such as high melting point, high hardness, great chemical stability and abrasion resistance. For those advantages, SiC has been utilized in a wide array of modern industries components under extreme conditions. The  application of SiC mainly focuses on four aspects like refractory materials, wear-resistant high-temperature parts, abrasive molds and bulletproof armor. 

 

Recently, since the era of 5G is coming, SiC has been discovered new functions in cellphone components. To deal with the growing function of mobile phones, we need to arrange chips and modules inside the mobile phone denser than before. Which causes severe electromagnetic susceptibility. SiC is considered to be well electromagnetic shielding materials because of its wave absorption characteristics. On the other hand, the denser the chips and modules arranged inside one mobile device, the greater heat it will be generates, thus, causing frequent malfunction when operating. SiC is an excellent flame-proof materials and equips high melting points, it can also play as thermally conductive material to prevent malfunction due to temperature increase as well as heat accumulation.

 

Since SiC is commonly used in components manufacturing in semiconductor industries, we tried HIT Ultrasonic Machining Module side add-on CNC machine to substitute expensive high precision equipment and gain great results in efficiency and tool life. It improved 2 times of efficiency and 3 times of tool life in the end；thus, creates 6 times of profit!

 

As forward, we know that SiC has excellent properties like hard and abrasion resistance, but it also has brittle properties that cannot endure excessive power of knocking. By conventional CNC method, the crashing between tools and SiC materials often creates micro-crack on the edge, causing shatter, uneven cutting surface.

 

Nowadays, manufacturers are seeking for solutions to machine more precision features to satisfy the growing demands in the market. To maximize components functions but minimize its size has been becoming a challenge to advanced materials machining. And SiC isn’t the exception. For precision feature, the common solution is to purchase a special purpose machine. Consequently, the high equipment cost burdens the manufacturers. Besides, the special purpose machine cannot be flexible use in different situations since it cannot perform well in other features.