Ultrasonic Machining Tool Holder - Grinding Wheel Series Grinding Wheel Toolholder HBT-30 Grinding Wheel Series♦ Specifications available: HBT-30-W02 / HSK-E40-W02♦ Suitable for CNC grinding processes, specifically for machining ring-shaped components in semiconductor manufacturing equipment (such as quartz rings, SiC wafer susceptors, etc.)♦ Achieve Higher Machining Efficiency & Material Removal Rate♦ Thread-locking grinding wheel Back to list Product Information HBT-30-W02 / HSK-E40-W02 Ultrasonic Grinding Wheel Toolholder 【Product Specification】 Model HBT-30-W02 / HSK-E40-W02 Tool Runout (4D) <5μm Working Frequency 20 kHz ~ 32 kHz Max. Spindle Speed 12,000 rpm Locking Mechanism Thread-locking Weight < 1 kg ATC YES CTS 70 bar 【Grinding Wheel Selection】 💡It is recommended to purchase grinding wheels from HIT to ensure optimal ultrasonic performance and vibration mode consistency. A Type Grinding Wheel B Type Grinding Wheel C Type Grinding Wheel 👉🏻 Preview of Ultrasonic Grinding Wheel Toolholder Application Cases: (Rough) Side Grinding of Quartz Glass with D80-Grinding Wheel Toolholder (Rough) Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder Side Grinding (with Polar Coordinates Programming) of Quartz Glass Surface Grinding of Silicon Carbide (SiC) with D100-Grinding Wheel Toolholder Surface Grinding of Carbon Ceramic Brake Disc (CCB) To improve the machining efficiency, workpiece quality, and tool life, by following the trend of ESG, feel free to CONTACT US. - Hantop Intelligence Tech. ✨Solution Provider of Advanced-Material Machining Technology & Smart Automation Modules✨ ☎️ +886-4-2285-0838 📧 sales@hit-tw.com