HIT Exhibition | SEMICON Taiwan 2024 2024/08/01 HIT Exhibition | SEMICON Taiwan 2024 📍 Hantop Intelligence Tech. @ SEMICON Taiwan 2024 📅 Date:Sep. 4th (Wed.) ~ 6th (Fri.) 🕑 Time:10:00 AM ~ 5:00 PM (Last day till 4:00 PM) 👣 Location:Taipei Nangang Exhibition Center (TAINEX), Hall 2, 4th Floor 🎪 HIT Booth No. R7420 🔗 SEMICON FREE Pre-Registration Taiwan's annual semiconductor international exhibition - SEMICON Taiwan 2024 - will have its grand opening next month (September)! This year's SEMICON Taiwan exhibition spans TaiNEX (Taipei Nangang Exhibition Center) Hall 1 and 2, with the theme "Breaking Limits: Powering the AI Era," focusing on popular topics in the semiconductor industry, such as advanced manufacturing processes, heterogeneous integration, compound semiconductors, smart manufacturing, and AI technology innovation. Hantop Intelligence Tech. will be located in the high-tech smart manufacturing area on the 4th floor of TaiNEX Hall 2, showcasing the best-selling Ultrasonic-Assisted Machining Module. It has been validated by global clients that it helps optimize the milling, drilling, and grinding process of semiconductor manufacturing equipment consumables (such as ceramic showerheads and ESC - electrostatic chucks) by enhancing machining efficiency, maintaining high-quality workpieces, and improving tool life, thereby increasing overall product yield and bringing higher productivity. Additionally, visitors can be expecting a new product launch - Ultrasonic Grinding Wheel Tool Holders - during the event! By utilizing ultrasonic high-frequency vibration-assisted machining mechanism, the tool holders are equipped with grinding wheels made with special formulations, providing new solutions for the making of semiconductor consumables (such as silicon carbide wafer susceptors and quartz rings). The overall machining efficiency can be accelerated with the improved MRR (Material Removal Rate); with the aid of ultrasonic high-frequency vibration, tool wear can be greatly reduced owing to better ceramic particle flushing. This allows for lowered production costs while producing high-quality products. (Figure 1. HIT will be launching a new product - Ultrasonic Grinding Wheel Tool Holders, bringing multiple benefits to ceramic grinding process) Moreover, HIT will be attending "Meet-the-Expert" event on the last day of the exhibition (September 6th) from 2:40 to 3:00 P.M. at the stage (R7316) on the 4th floor of TaiNEX Hall 2. The topic will be focusing on the application of ultrasonic-assisted machining technology in semiconductor manufacturing process. (Figure 2. SEMICON Taiwan 2024, HIT booth is located at R7420 on 4th floor of TaiNEX Hall 2; Meet-the-expert event will be on Sep. 6th at R7316 on 4th floor of TaiNEX Hall 2) HIT sincerely welcomes all the industry professionals to attend and visit us to discover solutions and ideas that help bring success to our business! 💡 Here's the latest Ultrasonic Machining Application Case Study!! Ultrasonic Machining of Al2O3 Ceramic : Profile Grinding | Hantop Intelligence Tech. 👍🏻 2x Higher Machining Efficiency 👍🏻 3x Better Workpiece Quality 👍🏻 Great Reduction in Tool Wear HIT utilized HSK-E40 ultrasonic machining module for profile grinding of aluminum oxide (Al2O3) ceramic. Along with HIT's new product - Ultrasonic Electroplated Diamond Grinding Tool, the high frequency micro-vibration of ultrasonic brought easier removal of ceramic particles. The reduction in grinding force and tool wear not only contributed to great workpiece quality but also allowed for an increase in feed rate, which enhanced 2x of the overall machining efficiency. 💡 Learn more about HIT ultrasonic-assisted machining of the advanced-materials (technical ceramics, quartz, glass, stainless steel, etc.) applied in semiconductor industry: Silicon Carbide (SiC): Micro-Drilling Silicon Carbide (SiC): G81 Drilling Silicon Carbide (SiC): Surface Grinding Silicon Carbide (SiC): (Helical) Circular Ramping Aluminum Oxide (Al2O3) Ceramic: Deep Hole Drilling Aluminum Oxide (Al2O3) Ceramic: G81 Micro-Drilling Aluminum Oxide (Al2O3) Ceramic: M2 Internal Threading Aluminum Oxide (Al2O3) Ceramic: Side Grinding Aluminum Oxide (Al2O3) Ceramic: Profile Grinding Quartz Glass: Micro-channel Trochoidal Grinding Soda-Lime Glass: Micro-Drilling AISI-304 Stainless Steel: Micro-Drilling Through Holes on curved surface - Hantop Intelligence Tech. Solution Provider of Advanced-Material Machining Technology & Smart Automation Modules +886-4-2285-0838 sales@hit-tw.com To improve the machining efficiency, workpiece quality, and tool life, by following the trend of ESG, feel free to CONTACT US. ←Back