Semiconductor Side Grinding of Aluminum Oxide (Al2O3) Ceramic

📈 Quality - size of edge-cracks 1.5x smaller | ⚙️ Tool Life - prevention of ceramic particle accumulation
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes Aluminum Oxide (Al2O3) Ceramic difficult to machine?



Aluminum Oxide (Alumina, Al2O3), also known as Alumina, is known for its good hardness and strength, wear resistance, etc.  Generally, the higher the purity, the more robust the chemical and electrical performance it displays. 

This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide reside in its material properties of high hardness and brittleness.  Poor workpiece quality, including massive edge-crakcs and subsurface damages, have become serious challenges during the machining process. 

 

☑️ Aluminum Oxide (Al2O3) Ceramic Machining Information

 
   Aluminum Oxide (Al2O3) Ceramic Machining Information 
  Material   Aluminum oxide (Al2O3) ceramic
  Feature   Ae 0.03mm_Ap 4mm
  *workpiece size 50*50*10mm
  Process   Side Grinding (rough grinding) 
  Ultrasonic Tool  Holder   BT30-R04-10
  Rotating Speed   16,000 rpm
  Tool Selection                #200 D6mm Electroplated diamond grinding tool     


 
HIT BT-30 ultrasonic machining module was used on side grinding of aluminum oxide ceramic
(Figure 1. HIT BT-30 ultrasonic machining module was used on side grinding of aluminum oxide ceramic)



 

HIT's Goal in Side Grinding of Aluminum Oxide (Al2O3) Ceramic


The goal is to do side grinding (rough grinding) of aluminum oxide ceramic with electroplated diamond grinding tool.  With HIT ultrasonic, it was expected to reduce size of edge-cracks on the workpiece and to reduce tool wear.





 

Ultrasonic-Assisted Side Grinding of Aluminum Oxide (Al2O3) Ceramic: Machining Results

 

Aluminum Oxide (Al2O3) Ceramic Side Grinding: Workpiece Quality

HIT ultrasonic-assisted side grinding of aluminum oxide ceramic helped reduce 1.5x size of edge-cracks
(Figure 2. HIT ultrasonic-assisted side grinding of aluminum oxide ceramic helped reduce 1.5x size of edge-cracks)


 
  • With HIT ultrasonic, the high frequency micro-vibration helped reduce grinding forces.
  • Under the same machining parameters (S 16,000rpm; F 400mm/min), the size of edge-cracks was 1.5x smaller than that without ultrasonic.




 

Aluminum Oxide (Al2O3) Ceramic Side Grinding: Tool Life


HIT ultrasonic-assisted side grinding of aluminum oxide ceramic brought better particle flushing, resulting in reduced tool wear
(Figure 3. HIT ultrasonic-assisted side grinding of aluminum oxide ceramic brought better particle flushing, resulting in reduced tool wear)


 
  • There would be increasing grinding forces if massive ceramic dust was accumulated on the electroplated grinding tool.  This would not only accelerate tool wear but also damage the surface quality of workpiece.
  • With HIT ultrasonic, the high frequency micro-vibration led to better ceramic particle flushing.  The prevention of ceramic particle accumulation helped reduce grinding forces and tool wear.




 

HIT Ultrasonic Technology Achievements in Side Grinding of Aluminum Oxide (Al2O3) Ceramic



📈 Quality - size of edge-cracks 1.5x smaller
⚙️ Tool Life - prevention of ceramic particle accumulation


 

Aluminum Oxide (Al2O3) Ceramic Side Grinding in Industry Application



Side Grinding of Aluminum Oxide (Al2O3) Ceramic is often applied in the Semiconductor industry, especially for spare parts of semiconductor manufacturing equipment, such as ceramic Electrostatic Chucks (ESC, E-chucks), substrates, showerheads, CEL, nozzles, etc.


This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide (alumina, Al2O3) reside in its material properties of high hardness and brittleness.  Poor hole quality, including massive edge-crakcs and subsurface damages, have become serious challenges during the machining process.

That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology, clients stopped worrying about poor workpiece quality while trying to speed up the processing time.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!




💡 Learn more about other HIT Ultrasonic Machining technical ceramic cases

💡 Introduction on HIT Ultrasonic Machining on advanced materials