Semiconductor Aluminum Oxide (Al2O3) Ceramic Machining : Micro-Drilling

🕜 Efficiency - enhanced 40% | 📈 Quality - hole quality enhanced 85% | ⚙️ Tool Life improved
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes Aluminum Oxide (Al2O3) Ceramic difficult to machine?



Aluminum Oxide (Alumina, Al2O3), also known as Alumina, is known for its good hardness and strength, wear resistance, etc.  Generally, the higher the purity, the more robust the chemical and electrical performance it displays. 

This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide reside in its material properties of high hardness and brittleness.  Poor hole quality, including massive edge-crakcs and subsurface damages, have become serious challenges during the micro-drilling process.

 

☑️ Aluminum Oxide (Al2O3) Ceramic Machining Information

 
   Aluminum Oxide (Al2O3) Ceramic Machining Information     
  Material   Aluminum oxide (Al2O3) ceramic
  Feature   Φ0.5 x 2.5mm (through holes)
   *aspect ratio 5x
  Process   Micro-drilling  
 
  Ultrasonic Tool Holder        		   HSKE40-R02-06
  Rotating Speed   11,000 ~ 13,000 rpm
  Tool Selection   Φ0.5mm - CVD diamond coating drill




 
HSK-E40 ultrasonic toolholder was used on aluminum oxide ceramic micro-drilling
(Figure 1. HSK-E40 ultrasonic toolholder was used on aluminum oxide ceramic micro-drilling)


aluminum oxide ceramic workpiece and HSK-E40 ultrasonic toolholder after machining
(Figure 2. aluminum oxide ceramic workpiece and HSK-E40 ultrasonic toolholder after machining)


 

HIT's Goal in Machining Aluminum Oxide (Al2O3) Ceramic


The goal is to enhance the machining efficiency, while improving the hole quality (especially exit holes) and maintaining the stability in tool life.

 

Ultrasonic-Assisted Machining Aluminum Oxide (Al2O3) Ceramic Results

 

Aluminum Oxide (Al2O3) Ceramic Micro-Drilling : Machining Efficiency

the comparison of machining parameters between HIT Ultrasonic and Non Ultrasonic
(Figure 3. the comparison of machining parameters between HIT Ultrasonic and Non Ultrasonic)

 
  • (Under the same feed per revolution) By raising the rotation speed from 7,000rpm to 12,000rpm, the feed rate would also be enhanced from 1.2mm/min to 2mm/min.  This allowed the machining efficiency to be enhanced 40%.
 
  • With HIT Ultrasonic, the high frequency micro-vibration helped reduce the cutting force.  The drilling process did not have to slow down around exit holes for fear of serious edge-cracks due to great cutting force.  As a result, HIT ultrasonic-assisted machining helped save up more time of the entire process. 


the machining efficiency was enhanced 40% with HIT Ultrasonic on micro-drilling aluminum oxide
(Figure 4. the machining efficiency was enhanced 40% with HIT Ultrasonic on micro-drilling aluminum oxide)



 

Aluminum Oxide (Al2O3) Ceramic Micro-Drilling : Hole Quality

the comparison of exit hole quality between HIT Ultrasonic and Non Ultrasonic on micro-drilling aluminum oxide
(Figure 5. the comparison of exit hole quality between HIT Ultrasonic and Non Ultrasonic on micro-drilling aluminum oxide)

 
  • With HIT Ultrasonic, the high frequency micro-vibration helped reduce the cutting force.  Especially when drilling through the exit holes, the lowered cutting force allowed for a 85% reduction in the size of edge-cracks (from 238.5µm to 35.5µm).
 
  • In conventional CNC machining, the cutting force could be really strong and hard to control.  This may cause great extrusion between the tool and workpiece, resulting in massive edge-cracks around the drilling holes.


the hole quality was enhanced 85% for the great reduction in edge-cracks with HIT Ultrasonic on micro-drilling aluminum oxide
(Figure 6. the hole quality was enhanced 85% for the great reduction in edge-cracks with HIT Ultrasonic on micro-drilling aluminum oxide)



 

HIT Ultrasonic Machining Technology Achievements


🕜 Efficiency - enhanced 40%
📈 Quality - hole quality enhanced 85% (size of edge-crack reduced to 35.5µm)
⚙️ Tool Life - improved


 

Aluminum Oxide (Al2O3) Ceramic Machining in Industry Application



Micro-drilling Aluminum Oxide (Al2O3) Ceramic is often applied in the Semiconductor industry, especially for ceramic showerheads or ceramic E-chucks as semiconductor fabrication commodities used within the etching or thin film processes.


This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide (alumina, Al2O3) reside in its material properties of high hardness and brittleness.  Poor hole quality, including massive edge-crakcs and subsurface damages, have become serious challenges during the micro-drilling process.

That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology, clients stopped worrying about poor workpiece quality while trying to speed up the processing time.  The machining efficiency can be greatly enhanced while improving both the micro- hole quality and the stability in tool life.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!


💡 Learn more about other HIT Ultrasonic Machining technical ceramic cases

💡 Introduction on HIT Ultrasonic Machining on advanced materials