Picture from HIT ultrasonic applications of ceramics crucibles
Brief introduction of ceramic substrates and how can HIT ultrasonic machining conquer the machining difficulties.
A ceramic substrate is a special process board where copper foil is directly bonded to the surface of an aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The manufactured ultra-thin composite substrate has excellent electrical insulation properties and high thermal conductivity. Therefore, the ceramic substrate has become the basic material of high-power electronic circuit structure technology. The ceramic substrate has high mechanical strength. It can also be used as a supporting part in order to carry components, finished surface can be smooth and flat, which withstands low temperature and high humidity environment, furthermore, ceramic substrates can also be processed into various complex shapes.
The processing of ceramic substrates follows the trend of minimizing parts and developing various functions to meet the market's demand for lightness and precision, and the difficulty of processing has also increased. The main processing methods of ceramic substrate micro-hole processing are laser processing and CNC processing. The main advantages of laser processing are high speed and high efficiency. Although the speed is fast, there are tapered holes (crack), and only low depth holes can be handled. Traditional CNC is good in shaping accuracy and surface roughness. However, the brittleness of the material results long processing time and the processing procedure may damage the contact area between the work piece and the tool, which may cause cracks or even largely shorten the tool life which ends up causing bigger overall cost.