HIT ceramic substrates machining introduction-Hantop Intelligence Tech.

Picture from HIT ultrasonic applications of ceramics crucibles 

Brief introduction of ceramic substrates

A ceramic substrate is a special process board where copper foil is directly bonded to the surface of an aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The manufactured ultra-thin composite substrate has excellent electrical insulation properties and high thermal conductivity. Therefore, the ceramic substrate has become the basic material of high-power electronic circuit structure technology.  The ceramic substrate has high mechanical strength. It can also be used as a supporting part in order to carry components, finished surface can be smooth and flat, which withstands low temperature and high humidity environment, furthermore, ceramic substrates can also be processed into various complex shapes.


Difficulties in Ceramic Machining

The processing of ceramic substrates follows the trend of minimizing parts and developing various functions to meet the market's demand for lightness and precision, and the difficulty of processing has also increased. The main processing methods of ceramic substrate micro-hole processing are laser processing and CNC processing. The main advantages of laser processing are high speed and high efficiency. Although the speed is fast, there are tapered holes (crack), and only low depth holes can be handled. Traditional CNC is good in shaping accuracy and surface roughness. However, the brittleness of the material results long processing time and the processing procedure may damage the contact area between the work piece and the tool, which may cause cracks or even largely shorten the tool life which ends up causing bigger overall cost.


What HIT Ultrasonic Machining Brings to Ceramic Machining

HIT ultrasonic machining module has improved the efficiency by more than 3 times in past customer experiences. With high frequency, tool wear can be significantly reduced. In addition, the Z-axis vibration can effectively remove cutting chips in alumina drilling. Ultrasonic cutting instead of traditional continuous cutting makes the tip of the tool difficult to store heat and extend the life of the tool. HIT has aluminum oxide parts machining, alumina oxide crucible machining, and zirconia micro-drilling cases in the semiconductor applications.

Ceramic Machining : Choose HIT