Semiconductor SiC (Silicon Carbide) Machining : Surface Grinding

🕜 Efficiency - 2x shorter total process time | 📈 Quality - no serious chipping or edge-cracks | ⚙️ Tool Life - 4x longer tool life with better particle flushing
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes SiC (Silicon Carbide) difficult to machine?



SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as SiC substrates, SiC wafer susceptors, SiC wafer carriers, SiC E-chucks, etc.

However, due to the high hardness and brittleness of silicon carbide, the risk of grinding SiC resides in poor surface and edge quality with massive size of chipping and edge-cracks.  If the grinding forces are not well-controlled (due to serious cumulative ceramic material particles stuck in the pores of grinding tool) during the process, the process would take more time in tool dressing with damaged workpiece quality and poor tool life.

 

☑️ SiC (Silicon Carbide) Machining Information

 
   SiC (Silicon Carbide) Machining Information     
  Material   SiC (Silicon Carbide)
  Feature   Ap 0.6mm
   *workpiece size: Φ107mm
  Process   Surface Grinding  
  Ultrasonic Tool Holder           BT30-R04-10
  Rotating Speed   4,000 ~ 6,000 rpm
  Tool Selection   #80 Φ20mm Metal bond diamond grinding tool  

 
HIT BT30 ultrasonic machining module was used on the machining of silicon carbide SiC grinding
(Figure 1. HIT BT30 ultrasonic machining module was used on the machining of silicon carbide SiC grinding)


 

HIT's Goal in Grinding SiC (Silicon Carbide)


Through the assistance of HIT ultrasonic-assisted machining technology, the goal is to reduce the total process time and tool wear, while maintaining great workpiece quality in the machining of SiC (Silicon Carbide) ceramic grinding.




 

Ultrasonic-Assisted Grinding SiC (Silicon Carbide) Machining Results

 

SiC (Silicon Carbide) Grinding: Machining Efficiency


HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can achieve 2 times shorter total process time, due to the fact that there was no need for tool dressing during the process
(Figure 2. HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can achieve 2 times shorter total process time, due to the fact that there was no need for tool dressing during the process)

 
  • With HIT ultrasonic, the high frequency micro-vibration helped with easier chip removal and better particle flushing.  The grinding tool constantly lifting from workpiece allowed cutting fluid to flush away cutting heat and ceramic particles.  This effectively prevented pores (between abrasives of the grinding tool from being filled with cumulative ceramic dust.  As a result, there was no need for tool dressing during the entire grinding process.
  • (Under the same machining parameters) Without ultrasonic, the grinding tool was constantly in contact with workpiece.  This resulted in the tool re-grinding irremovable ceramic particles as well as pores being filled with cumulative ceramic dust.  The tool would then need tool dressing due to decreased grinding ability.  As a result, there were 4 times of tool dressing during the entire grinding process.




 

SiC (Silicon Carbide) Grinding: Workpiece Quality


HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can achieve workpiece with smooth edge without serious chipping or edge-cracks
(Figure 3. HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can achieve workpiece with smooth edge without serious chipping or edge-cracks)

 
  • With HIT ultrasonic, the high frequency micro-vibration helped with easier chip removal and better ceramic particle flushing.  This effectively prevented pores (between abrasives) of the grinding tool from being filled with cumulative ceramic dust.  The lowered and stable grinding forces helped reduce chipping or cracks on the edge of workpiece with consistent size of tool marks on the surface.
  • (Under the same machining parameters) Without ultrasonic, the irremovable ceramic particles along with pores filled with cumulative ceramic dust caused quick loss in tool's grinding ability.  The inconsistent size of tool marks on the surface of workpiece also showed unstable and uneven grinding forces, which resulted in not only serious tool wear but also workpiece damage (chipping and edge-cracks).




 

SiC (Silicon Carbide) Grinding: Tool Life


HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can achieve better ceramic particle flushing and without the need for tool dressing during the process
(Figure 4. HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can achieve better ceramic particle flushing and without the need for tool dressing during the process)

 
  • With HIT ultrasonic, the high frequency micro-vibration helped with better ceramic particle flushing.  When the abrasive grains on the grinding tool became blunt after grinding, the grinding force would increase.  Thus, it generated the self-sharpening mechanism.  It made the worn-out abrasive grits fall off, and then the new diamond grits would come out to continue grinding.  Since there was no need for tool dressing, the total tool wear only came from the grinding process.
  • (Under the same machining parameters) Without ultrasonic, the irremovable ceramic particles along with pores filled with cumulative ceramic dust caused quick loss in tool's grinding ability.  The accumulation of ceramic dust was too fast for the self-sharpening mechanism to restore the tool's grinding ability.  As a result, there were 4 times of tool dressing during the grinding process, which caused even more tool wear.



HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can greatly reduce tool wear and achieve 4 times longer tool life
(Figure 5. HIT ultrasonic-assisted grinding silicon carbide SiC ceramic can greatly reduce tool wear and achieve 4 times longer tool life)




 

HIT Ultrasonic Machining Technology Achievements


🕜 Efficiency - 2x shorter total process time
📈 Quality - no serious chipping or edge-cracks
⚙️ Tool Life - improved 4x

 

SiC (Silicon Carbide) Grinding in Industry Application



Grinding of SiC (Silicon Carbide) is applied in the Semiconductor industry, especially for SiC wafer susceptors, SiC wafer carriers, SiC E-chucks (electrostatic chucks), etc. as key semiconductor manufacturing components within etching, thin fim, and CMP processes.


SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as SiC substrates, SiC wafer susceptors, SiC wafer carriers, SiC E-chucks, etc.  Since the stability of manufacturing process and product quality, as well as yield rate are all highly valued in the semiconductor industry, the chamber components which have direct contact with the wafer often have extremely high and strict standards on its product quality. 

However, due to the high hardness and brittleness of silicon carbide, the risk of grinding SiC resides in poor surface and edge quality with massive size of chipping and edge-cracks.  If the grinding forces are not well-controlled (due to serious cumulative ceramic material particles stuck in the pores of grinding tool) during the process, the process would take more time in tool dressing with damaged workpiece quality and poor tool life.


That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology, clients stopped worrying about poor workpiece quality while trying to speed up the processing time.  The machining efficiency can be greatly enhanced while improving both the surface and edge quality and the stability in tool life.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!



💡 Learn more about other HIT Ultrasonic Machining technical ceramic cases

💡 Introduction on HIT Ultrasonic Machining on advanced materials