Semiconductor SiC (Silicon Carbide) Grinding : (Helical) Circular Ramping

📈 Quality - surface roughness (Sa) improved by 72% in rough grinding | ⚙️ Tool Life - better particle flushing

What makes SiC (Silicon Carbide) difficult to machine?



SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as SiC substrates, SiC wafer susceptors, SiC wafer carriers, SiC E-chucks, etc.

However, due to the high hardness and brittleness of silicon carbide, the risk of (helical) circular ramping SiC resides in poor surface quality with poor surface roughness and massive tool marks.  If the grinding forces are not well-controlled (due to serious cumulative ceramic material particles stuck in the pores of grinding tool) during the process, the process would take more time in tool dressing with damaged workpiece quality and poor tool life.


 

☑️ SiC (Silicon Carbide) Ceramic (Helical) Circular Ramping Machining Information

 
   SiC (Silicon Carbide) Ceramic (Helical) Circular Ramping Information     
  Material   SiC (Silicon Carbide)
  Feature   Φ27 x 1mm
   *workpiece size: Φ110mm
  Process   (Helical) Circular Ramping_rough grinding  
  Ultrasonic Tool Holder           BT30-R04-10
  Machining Parameters   (Helical interpolation) S10,000rpm; F200mm/min; pitch 0.01mm
  (Circular ramping) S10,000rpm; F400mm/min; Ae 0.04mm; Ap 1mm
  Tool Selection   #150 Φ6mm Metal bond diamond grinding tool  


 
HIT BT30 ultrasonic machining module was used on (helical) circular ramping of silicon carbide SiC
(Figure 1. HIT BT30 ultrasonic machining module was used on (helical) circular ramping of silicon carbide SiC)


HIT ultrasonic-assisted (helical) circular ramping of silicon carbide SiC in the making of wafer susceptors
(Figure 2. HIT ultrasonic-assisted (helical) circular ramping of silicon carbide SiC in the making of wafer susceptors)


 

HIT's Goal in (Helical) Circular Ramping of SiC (Silicon Carbide)


Through the assistance of HIT ultrasonic-assisted machining technology, the goal is to improve the surface roughness of workpiece, while reduce tool wear in (helical) circular ramping of SiC (Silicon Carbide) ceramic.





 

Ultrasonic-Assisted (Helical) Circular Ramping of SiC (Silicon Carbide) Machining Results

 

SiC (Silicon Carbide) Ceramic (Helical) Circular Ramping: Workpiece Quality

HIT ultrasonic-assisted (helical) circular ramping of silicon carbide SiC greatly improved the surface roughness of workpiece with mitigating tool marks
(Figure 3. HIT ultrasonic-assisted (helical) circular ramping of silicon carbide SiC greatly improved the surface roughness of workpiece with mitigating tool marks)

 
  • With HIT ultrasonic, the high frequency micro-vibration helped reduce grinding forces.  Thie resulted in great improvement in the surface roughness (Sa) of workpiece and mitigation of tool marks.  The workpiece quality was enhanced by 72%.
  • Ultrasonic-assisted machining technology in rough grinding process helped improve surface roughness and tool marks.  This allowed for reduction in post-process time, which also increased machining efficiency.




HIT ultrasonic-assisted (helical) circular ramping of silicon carbide SiC helped enhance workpiece quality by 72% with improved surface roughness
(Figure 4. HIT ultrasonic-assisted (helical) circular ramping of silicon carbide SiC helped enhance workpiece quality by 72% with improved surface roughness)





 

SiC (Silicon Carbide) Ceramic (Helical) Circular Ramping: Tool Life

HIT ultrasonic-assisted (helical) circular ramping of silicon carbide brought better particle flushing, preventing the tool from ceramic dust accumulation
(Figure 5. HIT ultrasonic-assisted (helical) circular ramping of silicon carbide brought better particle flushing, preventing the tool from ceramic dust accumulation)

 
  • With HIT ultrasonic, it provided the tool with high frequency micro-vibration in Z-axis direction.  During the grinding process, the tool constantly lifting from workpiece brought easier inflow of cutting fluid.  This helped with better particle flushing, which prevented the grinding tool from ceramic dust accumulation.
  • Much less and slower accumulation of ceramic dust on the grinding tool helped reduce grinding forces.  This not only resulted in less tool wear, but also higher surface quality.




 

HIT Ultrasonic Machining Technology on (Helical) Circular Ramping of SiC (Silicon Carbide) Achievements



📈 Quality - surface roughness (Sa) improved by 72% in rough grinding
⚙️ Tool Life - better particle flushing

 

SiC (Silicon Carbide) Ceramic (Helical) Circular Ramping in Industry Application



(Helical) Circular ramping of SiC (Silicon Carbide) is applied in the Semiconductor industry, especially used as SiC wafer susceptors within the MOCVD process.


SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as SiC substrates, SiC wafer susceptors, SiC wafer carriers, SiC E-chucks, etc.

Within the MOCVD reactor chamber, SiC wafer susceptors are used to carry the substrates.  The susceptors absorb thermal energy to help with film growth.  Therefore, the product quality of susceptors will have direct influence on the quality of semiconductor epilayer.


That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology, clients stopped worrying about poor workpiece quality while trying to speed up the processing time.  The machining efficiency can be greatly enhanced while improving the surface quality and the stability in tool life.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!



💡 Learn more about other HIT Ultrasonic Machining technical ceramic cases

💡 Introduction on HIT Ultrasonic Machining on advanced materials