Semiconductor G81 Drilling of Silicon Carbide (SiC)

⚙️ Tool Life - 11.5x longer | 📈 Hole Quality - 4x better, reduction in size of edge-cracks
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes SiC (Silicon Carbide) difficult to machine?



SiC (Silicon Carbide) bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads.  

However, due to the high hardness and brittleness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks.  If the cutting force is not well-controlled and with poor ceramic particle flushing, both the hole quality and tool life will be severely impacted.


 
 

☑️ SiC (Silicon Carbide) G81 Drilling: Machining Information

 
   SiC (Silicon Carbide) G81 Drilling: Machining Information     
  Material   SiC (Silicon Carbide)
  Feature   Φ1.9 x 4mm (blind holes)
   *aspect ratio 2.1x
  Process   Drilling  
  Ultrasonic Toolholder           HSKE40-R02-06
  Ultrasonic Machining Process & Parameters        S 8,000rpm _ F 1mm/min _ Ultrasonic Power Level 50%
  G73 (Q 0.02) drilling to 1mm, and then G81 drilling to 4mm
  
  *process time: around 40 sec/per hole
  Tool Selection   #150 Φ1.9mm Electroplated grinding tool with CTS


 
SiC workpiece of HIT ultrasonic-assisted G81 drilling of silicon carbide
(Figure 1. SiC workpiece of HIT ultrasonic-assisted G81 drilling of silicon carbide)



 

HIT's Goal in G81 Drilling of SiC (Silicon Carbide)


The goal is to see how HIT ultrasonic-assisted machining technology can benefit the machining of G81 drilling on SiC (Silicon Carbide) in terms of tool life and hole quality.




 

Ultrasonic-Assisted G81 Drilling of SiC (Silicon Carbide): Machining Results

 

SiC (Silicon Carbide) G81 Drilling: Tool Life

HIT HSK-E40 ultrasonic machining module was used on silicon carbide SiC G81 drilling, which helped greatly reduce tool wear
(Figure 2. HIT HSK-E40 ultrasonic machining module was used on silicon carbide SiC G81 drilling, which helped greatly reduce tool wear)


the tool life was 11.5x longer with HIT ultrasonic-assisted G81 drilling of silicon carbide SiC
(Figure 3. the tool life was 11.5x longer with HIT ultrasonic-assisted G81 drilling of silicon carbide SiC)


*Original process & parameters suggested by tooling supplier: S 8,000rpm _ F 1mm/min _ Q 0.02mm _ G83
  • With HIT ultrasonic, the high frequency micro-vibration in Z-axis direction helped reduce cutting force.
  • The tool was not in constant contact with the workpiece, along with CTS (coolant through spindle) function, it helped remove the generated cutting heat.
  • Tool life can thus be 11.5x longer under great hole quality.



 

SiC (Silicon Carbide) Micro-Drilling : Hole Quality

HIT HSK-E40 ultrasonic machining module was used on silicon carbide SiC G81 drilling, which had smaller size of edge-cracks
(Figure 4. HIT HSK-E40 ultrasonic machining module was used on silicon carbide SiC G81 drilling, which had smaller size of edge-cracks)


the hole quality was 4x better with HIT ultrasonic-assisted G81 drilling of silicon carbide SiC
(Figure 5. the hole quality was 4x better with HIT ultrasonic-assisted G81 drilling of silicon carbide SiC)

 
  • Ultrasonic-assisted machining mechanism along with CTS allowed for better ceramic particle flushing under G81 process.
  • The great reduction in cutting force and cutting heat contributed to less tool wear and longer tool life, which helped maintain good drilling hole quality.




 

HIT Ultrasonic Machining Technology Achievements


⚙️ Tool Life - 11.5x longer
📈 Hole Quality - 4x better, reduction in size of edge-cracks



 

SiC (Silicon Carbide) G81 Drilling: Industry Application



Drilling of SiC (Silicon Carbide) is often applied in the Semiconductor industry, especially for SiC showerheads, SiC wafer carrier, etc. as key wafer foundry components within etching or thin film processes.


SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads.

However, due to the high hardness and brittleness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks and poor tool life.


That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology, clients stopped worrying about poor workpiece quality while trying to speed up the processing time.  The tool life can be greatly enhanced while improving the drilling hole quality.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!



💡 Learn more about other HIT Ultrasonic Machining technical ceramic cases


💡 Introduction on HIT Ultrasonic Machining on advanced materials