Semiconductor SiC (Silicon Carbide) Machining : Micro-Drilling

With HIT Ultrasonic optimized parameters, 📈 Hole Quality - enhanced 1.5x, reduction in size of edge-cracks | ⚙️ Tool Life - 3x longer

What makes SiC (Silicon Carbide) difficult to machine?



SiC (Silicon Carbide) bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads.  

However, due to the high hardness and brittleness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks.  If the thrust force and torque are not well-controlled during the drilling process, both the quality and positional precision of the holes will be severely impacted.


 

☑️ SiC (Silicon Carbide) Machining Information

 
   SiC (Silicon Carbide) Machining Information     
  Material   SiC (Silicon Carbide)
  Feature   Φ0.3 x 5.5mm (blind holes)
   *aspect ratio 18x
  Process   Micro-drilling  
  Ultrasonic Tool Holder           HSKE40-R01-06
  Optimized Parameters   S 12,000rpm; F 1mm/min; Q 0.02mm
  Machine Tool Type   C type vertical machining center



 
HIT ultrasonic-assisted machining on micro-drilling of SiC silicon carbide workpiece

(Figure 1. HIT ultrasonic-assisted machining on micro-drilling of SiC silicon carbide workpiece)


HSK-E40 ultrasonic toolholder was used on SiC silicon carbide micro-drilling

(Figure 2. HSK-E40 ultrasonic toolholder was used on SiC silicon carbide micro-drilling)



HIT ultrasonic-assisted machining process on micro-drilling of SiC silicon carbide

(Figure 3. HIT ultrasonic-assisted machining process on micro-drilling of SiC silicon carbide)



 

HIT's Goal in Machining SiC (Silicon Carbide)


The goal is to see how HIT ultrasonic-assisted machining technology can benefit the machining of micro-drilling on SiC (Silicon Carbide) in terms of the drilling hole quality.



 

Ultrasonic-Assisted Machining SiC (Silicon Carbide) Results

 

SiC (Silicon Carbide) Micro-Drilling : Hole Quality


the comparison of hole quality between HIT Ultrasonic and Without Ultrasonic on micro-drilling of SiC silicon carbide

(Figure 4. the comparison of hole quality between HIT Ultrasonic and Without Ultrasonic on micro-drilling of SiC silicon carbide)

 
  • With HIT Ultrasonic, the high frequency micro-vibration in Z-axis direction helped reduce cutting forces and worked as peck-drilling.  This resulted in better material and chip removal, and achieved 1.5x reduction in the size of edge-cracks (from 0.035mm to 0.023mm).




the hole quality was enhanced 1.5x for the reduction in edge-cracks with HIT Ultrasonic on micro-drilling of SiC silicon carbide
(Figure 5. the hole quality was enhanced 1.5x for the reduction in edge-cracks with HIT Ultrasonic on micro-drilling of SiC silicon carbide)



 

SiC (Silicon Carbide) Micro-Drilling : Tool Life


HIT ultrasonic-assisted machining of SiC silicon carbide micro-drilling helped greatly reduce tool wear
(Figure 6. HIT ultrasonic-assisted machining of SiC silicon carbide micro-drilling helped greatly reduce tool wear)

 
  • The reduction in cutting forces helped with easier material removal.  The tool constantly lifting from workpiece allowed for easier inflow of cutting fluid to remove chips and cutting heat.  This helped achieve 3x longer tool life, compared to that without ultrasonic.  The tool wear was not too serious, and the tool could keep drilling, while without ultrasonic, the tool wear was too serious, and it would soon cause tool breakage.




HIT ultrasonic-assisted machining of SiC silicon carbide micro-drilling helped achieve 3x longer tool life compared to that without ultrasonic
(Figure 7. HIT ultrasonic-assisted machining of SiC silicon carbide micro-drilling helped achieve 3x longer tool life compared to that without ultrasonic)




 

HIT Ultrasonic Machining Technology Achievements


With HIT Ultrasonic optimized parameters, 
📈 Hole Quality - enhanced 1.5x, reduction in size of edge-cracks
⚙️ Tool Life - 3x longer 


 

SiC (Silicon Carbide) Machining in Industry Application



Micro-drilling of SiC (Silicon Carbide) is often applied in the Semiconductor industry, especially for SiC showerheads, SiC wafer carrier, etc. as key wafer foundry components within etching or thin film processes.


SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads.  Showerheads are used for even distribution in the semiconductor industry.  The hole quality and configuration of the concentrated holes on the product are important to maintain high yield rate of wafer foundry. 

However, due to the high hardness and brittleness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks.  If the thrust force and torque are not well-controlled during the drilling process, both the quality and positional precision of the holes will be severely impacted.

That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology, clients stopped worrying about poor workpiece quality while trying to speed up the processing time.  The machining efficiency can be greatly enhanced while improving both the micro- hole quality and the stability in tool life.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!



💡 Learn more about other HIT Ultrasonic Machining technical ceramic cases


💡 Introduction on HIT Ultrasonic Machining on advanced materials