HIT Exhibition | SEMICON Taiwan 2025 2025/08/05 HIT Exhibition | SEMICON Taiwan 2025 『hit Ultrasonic Machining Technology: Redefining New Standards for the Processing of Advanced Materials for Semiconductor Manufacturing』 📍 Hantop Intelligence Tech. @ SEMICON Taiwan 2025 📅 Date：Sep. 10th (Wed.) ~ 12th (Fri.) 🕑 Time：10:00 AM ~ 5:00 PM (Last day till 4:00 PM) 👣 Location：Taipei Nangang Exhibition Center (TAINEX), Hall 2, 1st Floor 🎪 HIT Booth：Q5344 🎤Meet-the-Expert Event：Sep. 11th (Thur.) 10:40 - 11:00 AM, Stage Q5356 (Figure 1. SEMICON Taiwan 2025 - Floor plan of HIT's Booth Q5344 and Meet-the-Expert Stage Q5356) 💡HIT will be attending the Meet-the-expert speaking session during the second day of the exhibition (September 11th) from 10:40 to 11:00 AM at the Speech Stage on the 1st floor of TaiNEX Hall 2 (Booth No. Q5356). The session will focus on the topic: Ultrasonic Machining Redefines New Standards for Semiconductor Manufacturing Components. All industry professionals are warmly invited to attend! This year marks the 30th anniversary of SEMICON Taiwan 2025, which will grandly open next month (September)! The theme of this year's exhibition is: Leading with Collaboration. Innovating with the World. In response to the global trend of industrial transformation, the theme will be driven by the core concept of collaboration, uniting global semiconductor ecosystem partners to jointly launch the next thirty years of innovation. The exhibition will focus on topics such as AI chips, advanced packaging, 3DIC, Chiplet, FOPLP, heterogeneous integration, silicon photonics, quantum computing, and HBM high-bandwidth memory, showcasing the latest technologies and applications in chip design and advanced manufacturing driven by the AI era. Hantop Intelligence Tech. (HIT) will also align with the theme of advanced packaging this year. The focus will be on how ultrasonic machining technology will bring revolutionary ultrasonic process solutions to future semiconductor processes—from front-end chip fabrication to back-end wafer packaging—offering professional process development and optimization for key semiconductor components manufacturing. 【IC Fabrication - MOCVD Process: Wafer Susceptor】 (Figure 2. Key Component in Semiconductor MOCVD Process - Application of Silicon Carbide (SiC) Wafer Susceptor) 👉🏻Rough Grinding with Ultrasonic Process Solution ✨Machining Efficiency +3x ✨Workpiece Quality +1.4x ✨Tool Wear -3x 🔍Learn more: Curved Surface Grinding of Silicon Carbide (SiC) Surface Grinding of Silicon Carbide (SiC) (Helical) Circular Ramping of Silicon Carbide (SiC) Surface Grinding of Silicon Carbide (SiC) with D100-Grinding Wheel Toolholder 【IC Fabrication - Etching Process: Quartz Ring】 (Figure 3. Key Component in Semiconductor Etching Process - Application of Quartz Ring) 👉🏻Rough Grinding with Ultrasonic Process Solution ✨Process Time -1/2x ✨Material Removal Rate (MRR) +3x ✨Workpiece Quality +1.6x 🔍Learn more: Side Grinding (with Polar Coordinates Programming) of Quartz Glass (Rough) Side Grinding of Quartz Glass with D80-Grinding Wheel Toolholder 【IC Packaging - Packaging Process: Flip-Chip Lid / Heat Dissipating Plate】 (Figure 4. Key Component in Semiconductor Packaging Process - Application of Aluminum Silicon Carbide (AlSiC) Flip-Chip Lid / Heat Dissipating Plate) 👉🏻Rough Grinding with Ultrasonic Process Solution ✨Machining Efficiency +1.5x ✨Surface Quality +1.6x ✨Tool Life +2x 🔍Learn more: Rough Grinding of Aluminum Silicon Carbide (AlSiC) as Flip-Chip Lid 🎬 WATCH NOW to learn how the new material Aluminum Silicon Carbide (AlSiC) will be applied in high-end semiconductor packaging in the future! We look forward to welcoming all industry professionals to visit us and join this grand event. Please continue to follow HIT’s official website for the latest updates! - Hantop Intelligence Tech. ✨Ultrasonic Process Solution for Advanced Materials✨ ☎️ +886-4-2285-0838 📧 sales@hit-tw.com ←Back