2025/09/19

SEMICON Taiwan 2025 | Ultrasonic Machining: Revolution of Semiconductor Manufacturing

SEMICON Taiwan 2025 Successfully Concludes (September 10–12) 🎊
This year's three-day exhibition set a new record, with visitor attendance surpassing 100,000. Centered on the theme "Leading with Collaboration. Innovating with the World.," SEMICON Taiwan 2025 spotlighted industry trends by establishing dedicated zones for AI-driven semiconductor technologies, silicon photonics, and advanced smart manufacturing, emphasizing global collaboration and innovation.

【HIT@SEMICON Taiwan 2025: Ultrasonic Technology Highlights】

At this year's exhibition, Hantop Intelligence Tech. (HIT) aligned with key industry trends such as advanced packaging and new materials applications. With the theme "Ultrasonic Machining Innovation: Redefining New Standards for Semiconductor Manufacturing Components, " HIT showcased multiple groundbreaking process solutions across IC fabrication to IC packaging process. These demonstrations drew significant industry attention and recognition.

(Figure 1. HIT ultrasonic machining solutions for semiconductor IC manufacturing and advanced packaging)

(Figure 2. Hantop Intelligence Tech. at SEMICON Taiwan 2025)

Highlighted solutions presented by HIT included:

IC Fabrication - MOCVD Process: Wafer Susceptor

👉🏻Rough Grinding with Ultrasonic Process Solution
✨Machining Efficiency +3x
✨Workpiece Quality +1.4x
✨Tool Wear -3x

🔍Learn more:

🎬WATCH NOW to learn more about the application of Silicon Carbide (SiC) in semiconductor wafer processing!

IC Fabrication - Etching Process: Quartz Ring

👉🏻Rough Grinding with Ultrasonic Process Solution
✨Process Time -1/2x
✨Material Removal Rate (MRR) +3x
✨Workpiece Quality +1.6x

🔍Learn more:

IC Packaging - Packaging Process: Flip-Chip Lid / Heat Dissipating Plate

👉🏻Rough Grinding with Ultrasonic Process Solution
✨Machining Efficiency +1.5x
✨Surface Quality +1.6x
✨Tool Life +2x

🔍Learn more:

Rough Grinding of Aluminum Silicon Carbide (AlSiC) as Flip-Chip Lid

🎬WATCH NOW to learn how the new material Aluminum Silicon Carbide (AlSiC) will be applied in high-end semiconductor packaging in the future!

【HIT@SEMICON Taiwan 2025: Smart Manufacturing Journey - Meet-the-Expert】

On the second day of the show, HIT's Marketing Manager joined the Meet-the-Expert speech session in the High-Tech Smart Smart Manufacturing Area.
The session, themed "Ultrasonic Machining Redefines New Standards for Semiconductor Manufacturing Components," introduced how HIT's ultrasonic machining technology delivers revolutionary process solutions for semiconductor new materials. These innovations help overcome the limitations of traditional manufacturing methods for critical components, continuously setting new benchmarks for innovation while providing professional, high-quality products and services to the industry.

(Figure 3. SEMICON Taiwan 2025 Meet-the-Expert: HIT ultrasonic machining innovations redefine semiconductor component manufacturing standards)

(Figure 4. SEMICON Taiwan 2025 Meet-the-Expert: HIT's latest UD7 driver module design, fully compatible with CNC machining centers, featuring flexible modular design for quick installation and use)

(Figure 5. SEMICON Taiwan 2025 Meet-the-Expert: HIT UD7 driver module with intelligent automation functions for scanning, tracking, and locking frequencies, ensuring stable ultrasonic power output)

【HIT@SEMICON Taiwan 2025: Appreciation to All Visitors and Partners】

HIT sincerely thanks all the visitors during the exhibition!

HIT will deeply treasure the feedback from customers and business partners and turn this encouragement into motivation for growth.🌱

HIT aims to bring more innovative and diverse product applications this year, while continuing to provide high-quality products and dedicated professional services to customers both domestically and internationally.

HIT sincerely invites all industry experts to continue following and supporting us!💝

SEMICON Taiwan 2025 - special thanks to TOCHANCE Technology Co., Ltd. for the congratulatory bouquet

(Figure 6. SEMICON Taiwan 2025 - special thanks to TOCHANCE Technology Co., Ltd. for the congratulatory bouquet)

SEMICON Taiwan 2025 - appreciation to 3S Silicon Tech Inc. for visiting HIT s booth to explore ultrasonic applications

(Figure 7. SEMICON Taiwan 2025 - appreciation to 3S Silicon Tech Inc. for visiting HIT's booth to explore ultrasonic applications)

(Figure 8. SEMICON Taiwan 2025 - continuous crowd flow at HIT's booth)

(Figure 9. SEMICON Taiwan 2025 - HIT team providing detailed explanations of ultrasonic solutions to visitors)

(Figure 10. SEMICON Taiwan 2025 - appreciation to a leading Korean component manufacturer for visiting HIT and exploring our ultrasonic grinding wheel series)

【HIT@SEMICON Taiwan 2025: Want More? Stay Tuned with Hantop】

(Figure 11. HIT ultrasonic grinding wheel toolholder module, powered by the new UD7 driver design)

Ultrasonic Grinding Wheel Toolholder

---- As the Secret Weapon to Enter the Supply Chain of Semiconductor Industry ----

🔹 Best applied in the rough grinding of semiconductor advanced-material
🔹 Overall Machining Efficiency: 2 - 3x Higher
🔹 Material Removal Rate (MRR): More than 3x Higher
🔹 Great reduction in production costs and energy consumption

Equipped with the new UD7 driver module design

HIT s latest UD7 driver module set, including UD7 driver, external control box, and power transmitter

(Figure 12. HIT's latest UD7 driver module set, including UD7 driver, external control box, and power transmitter)

Delivering the best solutions for new material processing.✨

👉🏻CLICK HERE to learn more about our products.

HIT looks forward to seeing you again at SEMICON Taiwan 2026💝！

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Hantop Intelligence Tech.
✨Ultrasonic Process Solution for Advanced Materials✨
☎️ +886-4-2285-0838
📧 sales@hit-tw.com