HIT Exhibition | SEMICON Taiwan 2023
📍 Hantop Intelligence Tech. @ SEMICON Taiwan 2023
📅 Date：Sep. 6th (Wed.) ~ 8th (Fri.), 2023
🕑 Time：10:00 AM ~ 5:00 PM (Last day till 4:00 PM)
👣 Location：Taipei Nangang Exhibition Center (TAINEX), Hall 2, First Floor
🎪 HIT Booth No. P6025
🔗 SEMICON Taiwan 2023 Pre-Registration (FREE)
Taiwan's annual exhibition focusing on the semiconductor industry - SEMICON Taiwan 2023 International Exhibition - will be grandly held next month (September)!
This year's SEMICON Taiwan 2023 will for the first time span across TAINEX Halls 1 and 2, bringing together a complete microelectronics industrial ecosystem from both domestic and international sectors.
With "innovation and sustainability"as the exhibition's main themes, the event will focus on hot topics in the semiconductor industry, including advanced processes, heterogeneous integration, compound semiconductors, smart manufacturing, sustainable production, automotive chips, and so on.
Hantop Intelligence Tech.'s booth this year is located in the High-Tech Smart Manufacturing Area, where we will be showing how the Ultrasonic-Assisted Machining Module optimizes semiconductor manufacturing processes (such as etching and thin film) and the machining of the key consumable parts and semiconductor fabrication commodities (such as ceramic showerheads, electrostatic chucks, ceramic substrates, wafer carriers, wafer susceptors, etc.).
By enhancing the machining efficiency, maintaining high-quality workpieces, improving tool life, and ultimately boosting overall product yield, HIT's ultrasonic-assisted machining module products aim to bring higher productivity to the customers.
(Figure 1. SEMICON Taiwan 2023, HIT booth is located at No. P6025, TAINEX Hall 2 first floor; Meet-the-expert event will be on Sep. 8th at No. P5812, TAINEX Hall 2 first floor)
Furthermore, on the last day of the exhibition (Sep. 8th), from 11:20 to 11:40 in the morning, at the stage (which is located at Booth No. P5812) on the 1st floor of TAINEX Hall 2, HIT will be delivering a speech at "Meet-the-expert" event.
The presentation will focus on the application of ultrasonic-assisted machining technology in SiC (Silicon Carbide) micro-drilling, SiC wafer grinding, and TGV micro-drilling.
HIT sincerely welcomes all the industry professionals to attend and visit us to discover solutions and ideas that help bring success to our business!
💡 Learn more about HIT ultrasonic-assisted machining of the advanced-materials (technical ceramics, quartz, glass, stainless steel, etc.) applied in semiconductor industry:
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Hantop Intelligence Tech.
Solution Provider of Advanced-Material Machining Technology & Smart Automation Modules
+886-4-2285-0838
sales@hit-tw.com
To improve the machining efficiency, workpiece quality, and tool life, by following the trend of ESG, feel free to CONTACT US.
