Semiconductor Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder

🕜 Efficiency - 2x higher, and nearly 3x higher MRR | 📈 Quality - 1.5x better | ⚙️ Tool Life - greatly reduced tool wear
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  • HIT Achievements
  • Industry Application
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What makes Quartz Glass difficult to machine?



Quartz glass has high compressive strength, but also displays high hardness and brittleness.  Defects on the surface may have a serious impact on its overall material strength.

In semiconductor etching process equipment, quartz rings are used to secure the wafer, ensuring that the wafer remains stably attached to the electrostatic chuck (ESC, E-Chuck) during dry/wet etching.  Due to the high degree of contact between the quartz ring and the wafer, the surface roughness of the inner ring is subject to strict requirements.  Poor surface roughness of the inner ring may lead to excessive corrosion of the wafer by chemical gases or liquids during the etching process, severely affecting product yield.

 
 

☑️ Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder: Machining Information

 
    Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder:  Machining Information     
  Material   Quartz Glass
  Feature   Side Grinding Ae 0.7mm _ Ap 8mm
  *processing length 200mm
  Parameters   S 6,000rpm _ F 1,200mm/min _ Ultrasonic Power Level 100%    
  Ultrasonic Tool Holder           HBT40-W01 Grinding Wheel Toolholder 
  Tool Selection   #120 Φ100mm-T15mm Metal bond diamond grinding wheel   


 

【NEW PRODUCT - HBT-40 Ultrasonic Grinding Wheel Toolholder】For Side Grinding of Quartz Glass




--- As the Secret Weapon to Enter the Supply Chain of Semiconductor Industry ---

🔹 Best applied in the rough grinding of semiconductor advanced-material
🔹 Overall Machining Efficiency: 2 - 3x Higher
🔹 Material Removal Rate (MRR): More than 3x Higher
🔹 Great reduction in production costs and energy consumption


 

Product Specification

Model   HBT40-W01-2010          
Operating Frequency            20 ~ 32 kHz   
Max. Spindle Speed   24,000 rpm
Tool Interface   Thread Locking
CTS   70 bar

 
HIT HBT-40 ultrasonic grinding wheel toolholder module was used on side grinding of quartz glass
(Figure 1. HIT HBT-40 ultrasonic grinding wheel toolholder module was used on side grinding of quartz glass)



 

HIT's Goal in Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder


Through the assistance of HIT ultrasonic-assisted machining technology with the new product - Ultrasonic Grinding Wheel Toolholder, the goal is to enhance machining efficiency and material removal rate, while maintaining great workpiece quality and stable tool life.




 

Ultrasonic-Assisted Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder: Machining Results

 

Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder: Machining Efficiency

with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, feed rate can be raised 2x higher than the original parameters
(Figure 2. with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, feed rate can be raised 2x higher than the original parameters)


with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, radial depth of cut can be further enhanced, which brought nearly 3x higher material removal rate
(Figure 3. with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, radial depth of cut can be further enhanced, which brought nearly 3x higher material removal rate)

 
  • To optimize the side grinding process of quartz glass with HIT ultrasonic module, the high frequency micro-vibration helped reduce grinding force.  This allowed feed rate to be enhanced 2x higher, which reduced half of the total process time (from 20 seconds to 10 seconds).
  • Radial depth of cut (Ae) can be further enhanced on the premise of stable workpiece quality.  This then allowed MRR (Material Removal Rate) to be enhanced nearly 3x higher.


with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, overall machining efficiency can be 2x higher on the premise of stable workpiece quality
(Figure 4. with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, overall machining efficiency can be 2x higher on the premise of stable workpiece quality)



 

Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder: Workpiece Quality

with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, size of edge-cracks can be smaller than that without ultrasonic
(Figure 5. with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, size of edge-cracks can be smaller than that without ultrasonic)

 
  • To optimize the side grinding process of quartz glass with HIT ultrasonic module, the high frequency micro-vibration helped reduce grinding force.
  • Under 2x higher efficiency, the size of edge-cracks was stable (stable output of ultrasonic vibration amplitude).  Under the same parameters, the size of edge-cracks was around 1.5x smaller than that without ultrasonic.


with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, it helped reduce the size of edge-cracks, which brought 1.5x better workpiece quality
(Figure 6. with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, it helped reduce the size of edge-cracks, which brought 1.5x better workpiece quality)



 

Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder: Tool Life

with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, it helped greatly reduce tool wear compared to that without ultrasonic
(Figure 7. with HIT new product HBT-40 ultrasonic grinding wheel toolholder module, it helped greatly reduce tool wear compared to that without ultrasonic)

 
  • To optimize the side grinding process of quartz glass with HIT ultrasonic module, the high frequency micro-vibration helped reduce grinding force.
  • Under 2x higher efficiency, the wheel surface only appeared to have mild wear with stable workpiece quality.  However, under the same parameters, the wheel surface was shedding and dulling without ultrasonic.  This resulted in unstable workpiece quality.



 

HIT Ultrasonic Machining Technology Achievements in Side Grinding of Quartz Glass with D100-Grinding Wheel Toolholder


(with HIT HBT40 Ultrasonic Grinding Wheel Toolholder)


🕜 Efficiency - 2x higher, and nearly 3x higher MRR
📈 Quality - 1.5x better
⚙️ Tool Life - greatly reduced tool wear


 

Side Grinding of Quartz Glass with Grinding Wheel Toolholder in Industry Application



Side grinding of quartz glass is applied in the Semiconductor industry, especially used for quartz ring (focus/cover ring).


Quartz glass has excellent electrical insulation property and is inert to attacks from all kinds of acids, even in very high concentrations, except for hydrofluoric acid.  The material has high compressive strength, but also displays high hardness and brittleness.  Defects on the surface may have a serious impact on its overall material strength.

In semiconductor etching process equipment, quartz rings are used to secure the wafer, ensuring that the wafer remains stably attached to the electrostatic chuck (ESC, E-Chuck) during dry/wet etching.  Due to the high degree of contact between the quartz ring and the wafer, the surface roughness of the inner ring is subject to strict requirements.  Poor surface roughness of the inner ring may lead to excessive corrosion of the wafer by chemical gases or liquids during the etching process, severely affecting product yield.


That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology and HIT Ultrasonic Grinding Wheel Toolholder, clients stopped worrying about poor workpiece quality while trying to speed up the process time.  The machining efficiency and material removal rate can be enhanced while tool wear is greatly reduced.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!




💡 Learn more about other HIT Ultrasonic Machining of Semiconductor Advanced Material case studies: 



💡 Introduction on HIT Ultrasonic Machining on advanced materials: