Semiconductor Micro-Drilling of Silicon Carbide (SiC) with PCD Drill

🕜 Efficiency - 2.5x higher | 📈 Hole Quality - 1.8 better | ⚙️ Tool Wear - 3.2x less
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes Silicon Carbide (Sintered SiC) difficult to machine?



Silicon Carbide (SiC) bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads.  

However, due to the high hardness and brittleness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks.  If the cutting force is not well-controlled and with poor ceramic particle flushing, both the hole quality and tool life will be severely impacted.

 

☑️ Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Machining Information

 
    Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Machining Information
  Material   Silicon Carbide (Sintered SiC)
  *Material hardness HV2800
  *Workpiece fixture: wax on aluminum material
  Feature   Φ0.4 x 4mm (blind holes)
  *aspect ratio 10x
  Process   Micro-Drilling  
  Ultrasonic Toolholder           HSKE40-R02-06
  Ultrasonic Machining Process & Parameters        Ultrasonic Power Level 10%
  [Pilot Drilling Process] 
  S 8,000rpm _ F 1mm/min _ G83 _ Q 0.01mm _ 
  drilling depth 0.5mm
   
  Ultrasonic Power Level 10%
  [Main Drilling Process]
  S 8,000rpm _ F 1mm/min _ G83 _ Q 0.04mm _ 
  drilling depth 4mm
  
  *process time: 7.2 min/per hole
  Tool Selection   OSG MXD Φ0.4mm PCD drill

 
HIT HSKE40 ultrasonic machining module was used on optimizing the micro-drilling process of silicon carbide with PCD drill
(Figure 1. HIT HSKE40 ultrasonic machining module was used on optimizing the micro-drilling process of silicon carbide with PCD drill)



 

HIT's Goal in Micro-Drilling of Silicon Carbide (SiC) with PCD Drill


The goal is to see how HIT HSKE40 ultrasonic machining module can help optimize the process of micro-drilling of Silicon Carbide (Sintered SiC) with PCD drill in efficiency, hole quality, and tool life.




 

Ultrasonic-Assisted Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Machining Results

 

Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Machining Efficiency

with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, ultrasonic should be on in pilot drilling process
(Figure 2. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, ultrasonic should be on in pilot drilling process)


with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, Q-value in main drillilng process can be 4x higher, achieving an increase in total machining efficiency
(Figure 3. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, Q-value in main drillilng process can be 4x higher, achieving an increase in total machining efficiency)

 
  • To optimize the micro-drilling process of sintered SiC with PCD drill and HIT ultrasonic module, the high frequency micro-vibration helped reduce drilling force.
  • This allowed the volume of peck drill (Q) in the main drilling process to be raised 4x higher (from 0.01 to 0.04mm), which brought 2.5x higher overall machining efficiency (process time shortened from 18.3 to 7.2 min/per hole).


with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, it helps reduce the process time per hole, which brings 2.5x higher machining efficiency
(Figure 4. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, it helps reduce the process time per hole, which brings 2.5x higher machining efficiency)



 

Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Hole Quality

with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the size of edge-cracks was smaller with the optimized parameters
(Figure 5. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the size of edge-cracks was smaller with the optimized parameters)


with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the size of edge-cracks for each drilling hole was under 5µm
(Figure 6. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the size of edge-cracks for each drilling hole was under 5µm)

 
  • With HIT ultrasonic, the reduced drilling force helped stabilize the drilling process.
  • Under 2.5x higher machining efficiency, the average size of edge-cracks was well-controlled and was 1.8x smaller thant that without ultrasonic under the same (optimized) parameters.


with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the average size of edge-cracks was smaller, which brings 1.8x better hole quality
(Figure 7. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the average size of edge-cracks was smaller, which brings 1.8x better hole quality)



 

Micro-Drilling of Silicon Carbide (SiC) with PCD Drill: Tool Life

with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, tool wear observed from chisel edge was much smaller than that without ultrasonic
(Figure 8. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, tool wear observed from chisel edge was much smaller than that without ultrasonic)


with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, accumulation of ceramic particles observed from rake face was less than that without ultrasonic
(Figure 9. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, accumulation of ceramic particles observed from rake face was less than that without ultrasonic)


with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, accumulation of ceramic particles observed from flank face was less than that without ultrasonic
(Figure 10. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, accumulation of ceramic particles observed from flank face was less than that without ultrasonic)


with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the width of flank wear - VB after each drilling hole was smaller than that without ultrasonic
(Figure 11. with HIT HSKE40 ultrasonic machining module in micro-drilling of silicon carbide, the width of flank wear - VB after each drilling hole was smaller than that without ultrasonic)

 
  • With HIT ultrasonic, the high frequency micro-vibration brought easier inflow of cutting fluid, which led to better ceramic particle flushing.
  • Along with the reduced drilling force, the tool wear was 3.2x less than that without ultrasonic under the same (optimized) parameters.





 

HIT Ultrasonic Machining Technology Achievements in Micro-Drilling of Silicon Carbide (SiC) with PCD Drill



🕜 Efficiency - 2.5x higher with 4x higher Q-value (peck drilling)
📈 Hole Quality - 1.8 better with less edge-cracks
⚙️ Tool Wear - 3.2x less with better ceramic particles flushing and reduced drilling force

 

Micro-Drilling of Silicon Carbide (Sintered SiC) with PCD drill: Industry Application



Micro-Drilling of Silicon Carbide (Sintered SiC) is often applied in the Semiconductor industry, especially for SiC showerheads, SiC wafer carrier, etc. as key wafer foundry components within etching or thin film processes.


SiC (Silicon Carbide) has a Mohs hardness rating of 9, and it is an exceptional material choice for high-precision mechanical components.

This material bears excellent chemical and mechanical stability with high-temperature and thermal shock resistance, which also makes it an ideal material for semiconductor fabrication commodities, such as substrates and showerheads.

However, due to the high hardness and brittleness of silicon carbide, the risk of machining SiC resides in poor hole quality with massive size of edge-cracks and poor tool life.


That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology, clients stopped worrying about poor hole quality or tool life while trying to speed up the process time.  Both efficiency and tool life can be greatly enhanced while improving the drilling hole quality.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!



💡 Learn more about other HIT Ultrasonic Machining technical ceramic cases


💡 Introduction on HIT Ultrasonic Machining on advanced materials