Semiconductor (Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder

🕜 Efficiency - over 2x higher | 📈 Quality - 2x better, reduced size of edge-cracks
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes Aluminum Oxide (Al2O3) Ceramic difficult to machine?



Aluminum Oxide (Alumina, Al2O3), also known as Alumina, is known for its good hardness and strength, wear resistance, etc.  Generally, the higher the purity, the more robust the chemical and electrical performance it displays.

This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide reside in its material properties of high hardness and brittleness. Especially when grinding alumina ceramic, it usually faces with poor workpiece quality with massive edge-cracks and excessively time-consuming process.

 
 

☑️ (Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder: Machining Information

 
    (Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder: Machining Information
  Material   99.7% Aluminum oxide (Al2O3) ceramic
  Feature   Side Grinding Ae 0.1mm _ Ap 4mm
  *workpiece size: 50*50*10mm
  Parameters   S 6,000rpm _ F 3,600mm/min _ Ultrasonic Power Level 100%    
  Ultrasonic Tool Holder           HBT40-W01 Grinding Wheel Toolholder 
  Tool Selection   #80 Φ80mm-T40mm Electroplated diamond grinding wheel   


 

【NEW PRODUCT - HBT-40 Ultrasonic Grinding Wheel Toolholder】For (Rough) Side Grinding of Aluminum Oxide Ceramic




--- As the Secret Weapon to Enter the Supply Chain of Semiconductor Industry ---

🔹 Best applied in the rough grinding of semiconductor advanced-material
🔹 Overall Machining Efficiency: 2 - 3x Higher
🔹 Material Removal Rate (MRR): More than 3x Higher
🔹 Great reduction in production costs and energy consumption


 

Product Specification

Model   HBT40-W01-2010          
Operating Frequency            20 ~ 32 kHz   
Max. Spindle Speed   24,000 rpm
Tool Interface   Thread Locking
CTS   70 bar


 

HIT's Goal in (Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder


Through the assistance of HIT ultrasonic-assisted machining technology with the new product - Ultrasonic Grinding Wheel Toolholder, the goal is to enhance machining efficiency and workpiece quality.




 

Ultrasonic-Assisted (Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder: Machining Results

 

(Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder: Machining Efficiency

the table shows the comparison of maximum size of edge-cracks as the feed rate enhances between HIT Ultrasonic and the original process
(Figure 1. the table shows the comparison of maximum size of edge-cracks as the feed rate enhances between HIT Ultrasonic and the original process)


with HIT HBT-40 ultrasonic grinding wheel toolholder module, the overall machining efficiency can be over 2x higher
(Figure 2. with HIT HBT-40 ultrasonic grinding wheel toolholder module, the overall machining efficiency can be over 2x higher)

 
  • To optimize the side grinding (rough) process of aluminum oxide ceramic with HIT ultrasonic module, the high frequency micro-vibration helped reduce grinding force.  Compared to the original process (without ultrasonic), feed rate can be enhanced 2x higher under the same requirement on the workpiece quality (edge-crack < 0.300mm).
  • Compared to the original process (without ultrasonic), feed rate can be enhanced 1.5x higher under the same requirement on the workpiece quality (edge-crack < 0.500mm).



 

(Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder: Workpiece Quality

with HIT HBT-40 ultrasonic grinding wheel toolholder module, the maximum size of edge-cracks can be reduced compared to that without ultrasonic
(Figure 3. with HIT HBT-40 ultrasonic grinding wheel toolholder module, the maximum size of edge-cracks can be reduced compared to that without ultrasonic)


with HIT HBT-40 ultrasonic grinding wheel toolholder module, the workpiece quality can be 2x better
(Figure 4. with HIT HBT-40 ultrasonic grinding wheel toolholder module, the workpiece quality can be 2x better)

 
  • To optimize the side grinding (rough) process of aluminum oxide ceramic with HIT ultrasonic module, the high frequency micro-vibration helped reduce grinding force.
  • Under the same machining parameters (F: 3,600mm/min), HIT ultrasonic helped reduce the size of edge-cracks, bringing around 2x better overall workpiece quality.




 

HIT Ultrasonic Machining Technology Achievements in (Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder


(with HIT HBT40 Ultrasonic Grinding Wheel Toolholder)


🕜 Efficiency - over 2x higher
📈 Quality - 2x better, reduced size of edge-cracks

(Rough) Side Grinding of Aluminum Oxide with D80-Grinding Wheel Toolholder: Industry Application



Side Grinding of Aluminum Oxide (Al2O3) Ceramic is often applied in the Semiconductor industry, especially for ceramic Electrostatic Chucks (ESC, E-chucks) which uses electrostatic force to chuck/hold down wafer to ensure stability during wafer dicing process.


This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide (alumina, Al2O3) reside in its material properties of high hardness and brittleness.


That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology and HIT Ultrasonic Grinding Wheel Toolholder, clients stopped worrying about poor workpiece quality while trying to speed up the process time.  The machining efficiency and workpiece quality can be enhanced.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!




💡 Learn more about other HIT Ultrasonic Machining of Semiconductor Advanced Material case studies: 



💡 Introduction on HIT Ultrasonic Machining on advanced materials: