Semiconductor (Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder

📈 Surface Quality - 1.4x better, with improved surface roughness (Sa) | ⚙️ Reduced tool wear, remaining fine grinding ability
  • Difficulties in Machining
  • HIT Achievements
  • Industry Application
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What makes Aluminum Oxide (Al2O3) Ceramic difficult to machine?


Aluminum Oxide (Alumina, Al2O3), also known as Alumina, is known for its good hardness and strength, wear resistance, etc.  Generally, the higher the purity, the more robust the chemical and electrical performance it displays.

This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide reside in its material properties of high hardness and brittleness. Especially when grinding alumina ceramic, it usually faces with poor workpiece quality with massive edge-cracks and excessively time-consuming process.

 

☑️ (Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder: Machining Information

 
    (Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder: Machining Information
  Material   99.7% Aluminum oxide (Al2O3) ceramic
  Feature   Side Grinding Ae 60mm _ Ap 0.05mm
  *workpiece size: 50*50*10mm
  Parameters   S 3,000rpm _ F 500mm/min _ Ultrasonic Power Level 100%
  *process time: around 40 sec    
  Ultrasonic Tool Holder           HBT40-W01 Grinding Wheel Toolholder
  Tool Selection   #200 Φ100mm-T40mm Electroplated diamond grinding wheel   

 

 

【NEW PRODUCT - HBT-40 Ultrasonic Grinding Wheel Toolholder】For Surface Grinding of Aluminum Oxide Ceramic




--- As the Secret Weapon to Enter the Supply Chain of Semiconductor Industry ---

🔹 Best applied in the grinding process of semiconductor advanced-material
🔹 Overall Machining Efficiency: 2 - 3x Higher
🔹 Material Removal Rate (MRR): More than 3x Higher
🔹 Great reduction in production costs and energy consumption


 

Product Specification

Model   HBT40-W01-2010          
Operating Frequency            20 ~ 32 kHz   
Max. Spindle Speed   24,000 rpm
Tool Interface   Thread Locking
CTS   70 bar


 

HIT's Goal in (Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder


Through the assistance of HIT ultrasonic-assisted machining technology with the new product - Ultrasonic Grinding Wheel Toolholder, the goal is to enhance machining efficiency and workpiece quality.




 

Ultrasonic-Assisted (Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder: Machining Results

 

(Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder: Workpiece Quality

with HIT HBT-40 ultrasonic grinding wheel toolholder module, the surface roughness can be improved compared to that without ultrasonic
(Figure 1. with HIT HBT-40 ultrasonic grinding wheel toolholder module, the surface roughness can be improved compared to that without ultrasonic)


with HIT HBT-40 ultrasonic grinding wheel toolholder module, the overall workpiece quality can be 1.4x better
(Figure 2. with HIT HBT-40 ultrasonic grinding wheel toolholder module, the overall workpiece quality can be 1.4x better)

 
  • To optimize the surface grinding (fine) process of aluminum oxide ceramic with HIT ultrasonic module, the high frequency micro-vibration helped reduce grinding force.
  • Under the same machining parameters, the surface roughness can be improved with HIT ultrasonic, which brought 1.4x better overall workpiece quality.



 

(Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder: Tool Life

with HIT HBT-40 ultrasonic grinding wheel toolholder module, it helped the grinding wheel maintain great grinding ability with less tool wear
(Figure 3. with HIT HBT-40 ultrasonic grinding wheel toolholder module, it helped the grinding wheel maintain great grinding ability with less tool wear)

 
  • To optimize the surface grinding (fine) process of aluminum oxide ceramic with HIT ultrasonic module, the high frequency micro-vibration and better ceramic particles flushing helped reduce grinding force.
  • Under the same machining parameters, tool wear can be reduced compared to that without ultrasonic.  Most of the diamonds on the wheel surface still had acute angles (stable grinding ability) after machining.




 

HIT Ultrasonic Machining Technology Achievements in (Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder


(with HIT HBT40 Ultrasonic Grinding Wheel Toolholder)


📈 Surface Quality - 1.4x better, with improved surface roughness (Sa)
⚙️ Reduced tool wear, remaining fine grinding ability


 

(Fine) Surface Grinding of Aluminum Oxide with D100-Grinding Wheel Toolholder: Industry Application



Side Grinding of Aluminum Oxide (Al2O3) Ceramic is often applied in the Semiconductor industry, especially for ceramic Electrostatic Chucks (ESC, E-chucks) which uses electrostatic force to chuck/hold down wafer to ensure stability during wafer dicing process.


This material has plenty of excellent mechanical and chemical properties that allow for a wide range of industrial applications.  For instance, its great chemical resistance and thermal stability have made it ideal for key components in semiconductor processing, wafer chucks, as well as CMP plates.

The major difficulties in machining aluminum oxide (alumina, Al2O3) reside in its material properties of high hardness and brittleness.


That was when HIT's Ultrasonic Machining Module came to help!  HIT offers a comprehensive solution in machining advanced materials.  With the assistance of HIT's Ultrasonic Machining Technology and HIT Ultrasonic Grinding Wheel Toolholder, clients stopped worrying about poor workpiece quality while trying to speed up the process time.  The machining efficiency and workpiece quality can be enhanced.  HIT assures its clients of not only matching up with their requirements, but also achieving even better outcomes!




💡 Learn more about other HIT Ultrasonic Machining of Semiconductor Advanced Material case studies: 



💡 Introduction on HIT Ultrasonic Machining on advanced materials: