2025/03/20

TIMTOS 2025 | HIT Game-Changing Ultrasonic Technology Redefines Manufacturing!

Taipei International Machine Tool Exhibition (TIMTOS 2025) Concluded Successfully on March 8th!! 🎊

This year the exhibition themed "Integrate to Innovate," showcasing not only the latest trends and innovative technologies in the global machine tool industry but also focusing on the applications of AI and robotics. It attracted over 1,000 exhibitors using 6,100 booths to display the world's top smart manufacturing solutions.

【HIT_TIMTOS 2025 | Booth Display and Visitors During the Exhibition】

(Figure 1. Hantop Intelligence Tech. participated in TIMTOS 2025 Taipei International Machine Tool Exhibition)

During the exhibition, Hantop Intelligence Tech. (HIT) showcased several innovative technologies, including:

Best-Selling Product: Ultrasonic Assisted Machining Module Applied to the Rough Milling Process Optimization for STAVAX Mould Steel

👍🏻Machining Efficiency increased by 5.5x
👍🏻Tool Life extended by 5x
👍🏻Suppression of Burrs Formation

New Product: Ultrasonic Grinding Wheel Holder Provides a Brand New Grinding Solution for Semiconductor Equipment Components (such as Quartz Rings, Wafer Susceptors, etc.)

In addition, HIT will soon launch the "Ultrasonic High-Speed Spindle UTD30" and the "2D Visualization Tool Dynamic Runout Measuring Instrument", aiming to offer customers more cost-effective and comprehensive machining technology solutions.

(Figure 2. constant stream of visitors at HIT's booth during TIMTOS 2025)

At this exhibition, beyond its own booth display, HIT also collaborated with several major machine tool manufacturers to jointly showcase ultrasonic machining technology, offering more integrated services to customers.

Among these, Tongtai Machine & Tool Co. Ltd. partnered with HIT to provide machining solutions for processing hard-and-brittle materials in semiconductor equipment components. In addition to integrating related processing applications with the ultrasonic tool holder, they also specially showcased HIT's new product - Ultrasonic Grinding Wheel Holder, launching a brand new grinding solution for hard-and-brittle semiconductor materials.

(Figure 3. HIT and Tongtai Machine & Tool Co. Ltd. in collaboration, providing customers with processing solutions for hard-and-brittle semiconductor materials)

(Figure 4. HIT and Tongtai Machine & Tool Co. Ltd. showcase ultrasonic machining module and new product – ultrasonic grinding wheel toolholder)

During the exhibition, HIT also partnered with Fair Friend Group (FFG) by integrating ultrasonic products with their vertical machining centers. They demonstrated HIT's new ultrasonic grinding wheel toolholder in a simulating processing operation, unveiling a grinding solution for hard-and-brittle semiconductor materials.

(Figure 5. HIT in cooperation with Fair Friend Group, demonstrating the simulated process of the ultrasonic grinding wheel toolholder in operation)

(Figure 6. HIT in collaboration with Fair Friend Group, providing customers with processing solutions for hard-and-brittle semiconductor materials)

Falcon Machine Tools Co. Ltd. also renewed its collaboration with HIT at the exhibition, showcasing HIT's new product - HBT-40 Ultrasonic Grinding Wheel Toolholder - designed for grinding applications on semiconductor silicon carbide (SiC) materials, adding new business opportunities to the grinding market.

(Figure 7. HIT in collaboration with Falcon Machine Tools Co. Ltd., showcasing HIT's new ultrasonic grinding wheel toolholder in its application for grinding silicon carbide)

Furthermore, HIT partnered for the first time with Campro Precision Machinery Co. Ltd., installing HIT's ultrasonic machining module on their vertical machining center. They simulated the processing of semiconductor alumina (Al₂O₃) ceramic materials and demonstrated the benefits of ultrasonic-assisted machining optimization.

(Figure 8. HIT in collaboration with Campro Precision Machinery Co. Ltd., where their vertical machining center equipped with HIT's ultrasonic machining module has been upgraded into an indispensable secret weapon in the semiconductor equipment component supply chain)

One of HIT's partners, Tech-Plus Precision Machinery Industry Co. Ltd., also exhibited HIT's HSK-E32 ultrasonic toolholder at the exhibition. They demonstrated the integration of their micro precision machining equipment with HIT's ultrasonic machining technology—paving the way for industry leaders to become experts in the micro machining of hard-and-brittle semiconductor materials.

(Figure 9. HIT in collaboration with Tech-Plus Precision Machinery Industry Co. Ltd., combining HIT's ultrasonic machining module with their micro precision machining equipment to deliver a brand new solution for the micro-machining of hard-and-brittle semiconductor materials)

HIT, in collaboration with Royal Precision Tools Co. Ltd., developed the ultrasonic high-speed spindle that integrates HIT's non-contact power transmission system into the spindle. This innovation helps transform traditional CNC machine tools into machines capable of processing advanced hard-and-brittle semiconductor materials, offering a higher value-added solution for those looking to purchase new equipment!

(Figure 10. HIT and Royal Precision Tools Co. Ltd. collaboratively developed the ultrasonic high-speed spindle, significantly enhancing the value-added potential and marketability of CNC machine tools)

【HIT_TIMTOS 2025 | Award of Eminence Winner of Taiwan Machine Tools Industry Award 2025 for Excellence in Research and Innovation!】

(Figure 11. HIT participated in the Machine Tool R&D Innovative Product Competition with its new product – Non-contact Power Transmission: Ultrasonic High-Speed Spindle UTD30)

HIT once again took part in the "17^th Machine Tool R&D Innovative Product Competition" held during this exhibition, entering with its new product – Non-contact Power Transmission: Ultrasonic High-Speed Spindle UTD30. It was honored with an Award of Eminence in the category of component for CNC machine tool and other NC machine tools! 🎉

HIT s R&D Manager explains the core technology and application of the ultrasonic high-speed spindle to the competition judges

(Figure 12. HIT's R&D Manager explains the core technology and application of the ultrasonic high-speed spindle to the competition judges)

(Figure 13. HIT is honored with an Award of Eminence for its new ultrasonic high-speed spindle at the competition)

(Figure 14. HIT has consecutively received the Award of Eminence in the category of component for CNC machine tool and other NC machine tools for three consecutive competitions)

【HIT_TIMTOS 2025 | Thank You to All Visitors and Industry Leaders】

HIT sincerely thanks all the exhibitors and industry leaders who visited during the exhibition!
The feedback from customers and exhibitors is deeply appreciated and will serve as nourishment for continuous growth 🌱.
We look forward to bringing even more innovative and diverse product applications to our customers in the future while maintaining our commitment to high-quality products and professional, attentive service.
We also invite all industry leaders to continue following and supporting HIT💝.

(Figure 15. TIMTOS 2025 - Thank you to the Head of Japan's Roku-Roku Smart Technology Co., LTD. for personally visiting HIT booth to learn about ultrasonic products and applications)

(Figure 16. TIMTOS 2025 - Thank you to HIT's Japanese business agent, Dynamic Tools Corporation ダイナミックツール株式会社, for once again visiting HIT booth to learn about new ultrasonic products)

(Figure 17. TIMTOS 2025 - Thank you to the Swiss spindle giant FISCHER Spindle Group AG for personally visiting HIT booth to learn about ultrasonic products and to discuss collaboration opportunities)

(Figure 18. TIMTOS 2025 - Thank you to the industry leaders for visiting HIT booth to learn about new ultrasonic products and related applications)

(Figure 19. TIMTOS 2025 - Thank you to the industry leaders for visiting HIT booth to learn about new ultrasonic products and related applications)

(Figure 20. TIMTOS 2025 - Thank you to the international visitors for coming to HIT booth to learn about ultrasonic products and related applications)

💡 Learn more about HIT ultrasonic optimized solution for machining of the advanced-materials:

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Hantop Intelligence Tech.
Optimized Solution for Machining of Semiconductor Advanced-Material with Ultrasonic-Assisted Machining Module
+886-4-2285-0838
sales@hit-tw.com

To improve the machining efficiency, workpiece quality, and tool life, by following the trend of ESG, feel free to CONTACT US.